Leadframe and chip package applying the same

A leadframe including multiple leadframe assemblies is provided, wherein each leadframe assembly includes multiple leadframe units. Each leadframe unit includes a chip holder, multiple leads, and a molding gate. The leads are disposed around the chip holder, and the molding gates of the leadframe un...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHUNG, KUO-SHENG, FANG, HUIIN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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