Pb free Ag paste composition for PDP address electrode

The present invention provides a Pb free Ag paste composition for a PDP address electrode comprising (a) 60 to 90% by weight of an Ag powder; (b) 1 to 10% by weight of a Pb free inorganic binder; (c) 0.001 to 1% by weight of an inorganic thickener; and (d) 5 to 38% by weight of an alkali-soluble, ne...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: PARK, CHAN-SEOK, PARK, SEONG-MO, PAEK, SIN-HYE, CHUNG, BYUNG-JOO
Format: Patent
Sprache:chi ; eng
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