Positive photoresist composition for spinless (slit) coating

A positive photoresist composition for spinless(slit) coating is disclosed. The positive photoresist composition includes 5~50 parts by weight of an acrylic or novolac binder resin, 0.1~50 parts by weight of a photoactive compound, 0.001~5 parts by weight of a silicon compound containing epoxy or am...

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Bibliographische Detailangaben
Hauptverfasser:	KIM, YOUNG-KEUN, CHOI, SUK-YOUNG, WOO, JE-SUN, HONG, SEONG-JAE, SEO, HYUN-JIN, RYU, MI-SUN, YOO, KWON-YIL, JUNG, SANG-HYUP, CHOI, BUM-YOUNG, KIM, MIN-JI, CHOI, YOUNG-SOO, WOO, SEUNG-WOO, JEONG, YONG-MAN, KIM, WOONG, PAE, YOU-LEE, LEE, KEUN-JOO, JUNG, NAKIL, LEE, JAE-HWAN, LEE, SU-HYUN, HAN, CHEOL, CHOI, JAE-LOK, CHA, HYUK-JIN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS
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Beschreibung
Zusammenfassung:	A positive photoresist composition for spinless(slit) coating is disclosed. The positive photoresist composition includes 5~50 parts by weight of an acrylic or novolac binder resin, 0.1~50 parts by weight of a photoactive compound, 0.001~5 parts by weight of a silicon compound containing epoxy or amine group, and 0.001~5 parts by weight of a fluorine-based or silicon-based surfactant. A solvent is added to the composition so that viscosity becomes 2~20 cps. The positive photoresist composition may form a uniform coating layer without any coating defects when a layer such as an organic insulating layer is formed on a substrate with a spinless coaler, and is easy to control edge profile of the coating layer.