Method for electrodepositing a metal, especially copper, use of said method and integrated circuit
An explanation is given of, inter alia, a method in which a contact hole (18) to an interconnect (14) in an insulating layer (16) is fabricated. A barrier layer (20) is subsequently applied. Afterward, a photoresist layer (30) is applied, irradiated and developed. With the aid of a galvanic method,...
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| creator | LINDNER, CHRISTINE BRADL, STEPHAN KERKEL, KLAUS |
| description | An explanation is given of, inter alia, a method in which a contact hole (18) to an interconnect (14) in an insulating layer (16) is fabricated. A barrier layer (20) is subsequently applied. Afterward, a photoresist layer (30) is applied, irradiated and developed. With the aid of a galvanic method, a copper contact (32) is then produced in the contact hole (18). Either the barrier layer (22) serves as a boundary electrode in the galvanic process. Critical metal contaminations are kept down by this method in production. |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Method for electrodepositing a metal, especially copper, use of said method and integrated circuit |
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