Full-contact type exposure device
The invention provides a full-contact type exposure device that allows high adherence of a photo mask with a board. Upon completion of prescribed processing such as positioning, a controller 99 controls a moving mechanism 21 to move a platen 20 upward, thereby moving the photo mask 1 and a board 2 c...
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creator | ISAO, MOMII TAJIMA, TSUNESOU |
description | The invention provides a full-contact type exposure device that allows high adherence of a photo mask with a board. Upon completion of prescribed processing such as positioning, a controller 99 controls a moving mechanism 21 to move a platen 20 upward, thereby moving the photo mask 1 and a board 2 closer, and to stop at a position where a sealed space is formed between the two. At the same time a controller 99 starts vacuuming by controlling a vacuum pump 51. By this vacuum the pressure in the space between the photo mask 1 and board 2 becomes negative, and the photo mask 1 bends downward with its center area sagging and contacting the board 2. The controller 99 controls a cam drive mechanism 31 to rotate cams 30 while vacuuming, allowing the photo mask 1 to gradually make contact with the board 2 from the center area to its periphery while pushing out the air gradually from the center to the periphery, thereby completing full contact with the board 2. |
format | Patent |
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Upon completion of prescribed processing such as positioning, a controller 99 controls a moving mechanism 21 to move a platen 20 upward, thereby moving the photo mask 1 and a board 2 closer, and to stop at a position where a sealed space is formed between the two. At the same time a controller 99 starts vacuuming by controlling a vacuum pump 51. By this vacuum the pressure in the space between the photo mask 1 and board 2 becomes negative, and the photo mask 1 bends downward with its center area sagging and contacting the board 2. 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Upon completion of prescribed processing such as positioning, a controller 99 controls a moving mechanism 21 to move a platen 20 upward, thereby moving the photo mask 1 and a board 2 closer, and to stop at a position where a sealed space is formed between the two. At the same time a controller 99 starts vacuuming by controlling a vacuum pump 51. By this vacuum the pressure in the space between the photo mask 1 and board 2 becomes negative, and the photo mask 1 bends downward with its center area sagging and contacting the board 2. The controller 99 controls a cam drive mechanism 31 to rotate cams 30 while vacuuming, allowing the photo mask 1 to gradually make contact with the board 2 from the center area to its periphery while pushing out the air gradually from the center to the periphery, thereby completing full contact with the board 2.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES |
title | Full-contact type exposure device |
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