HIGH DENSITY DESIGN FOR ORGANIC CHIP CARRIERS

An organic integrated circuit chip carrier for high density integrated circuit chip attach, wherein the contact pads or microvias which provide electrical interconnections to external circuitry are located in a first array pattern, while the plated through holes or through-vias are located in a seco...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHERYL L TYTRAN-PALOMAKI, ROBERT D SEBESTA, TIMOTHY F CARDEN, DAVID B STONE, TODD W DAVIES, ROSS WILLIAM KEESLER
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CURRENT COLLECTORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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