THERMAL DEFORMATION MANAGEMENT FOR CHIP CARRIERS

A chip carrier constituted of an organic laminate which incorporates structure compensating for thermal deformation of the carrier. Moreover, disclosed is a method of counteracting the thermal deformations encountered by chip carriers, especially during solder reflow, which is predicated on the unif...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SEUNGBAE PARK, VOYA RISTA MARKOVICH, SANJEEV BALWANT SATHE, PETER A. MOSCHAK
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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