Method for adhering and sealing a silicon chip in an integrated package
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| creator | YEW CHEE KIANG ENG KIAN TENG CHAN BOON PEW TOH TUCK FOOK CHAN MIN YU LOW SIU WAF GOH JING SUA YEE PAK HONG |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Method for adhering and sealing a silicon chip in an integrated package |
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