Surface mount solder assembly of leadless intergrated circuit packages to substrates

Described are a process for soldering at least one component having solder bumps to a substrate and a process for forming solder bumps on metal pads of an element, such as an IC package or substrate or both. The bumps are formed by stencil printing solder paste deposits on the metal pads, heating th...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WOODS, WILLIAM LONZO, JR, DUDDERAR THOMAS DIXON, DEGANI YINON
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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