WAFER FURNACE WITH VARIABLE FLOW GAS JETS

A method of forming a sheet wafer 1) passes at least two filaments through a molten material to produce a partially formed sheet wafer, 2) directs a cooling fluid at a flow rate toward the partially formed sheet wafer to convectively cool a given portion of the partially formed sheet wafer, and 3) m...

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Bibliographische Detailangaben
Hauptverfasser: LIU, LIANGHONG, HUANG, WEIDONG, VAN GLABBEEK, LEO, YAMARTINO, STEPHEN, HITCHCOCK, DAVID
Format: Patent
Sprache:eng
Schlagworte:
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