METHOD AND APPARATUS FOR REMOVING A REVERSIBLY MOUNTED DEVICE WAFER FROM A CARRIER SUBSTRATE

New demounting methods and apparatuses for separating temporarily, permanently, or semi-permanently bonded substrates and articles formed froth those methods and apparatuses are provided. The methods comprise demounting a device wafer from a carrier wafer or substrate thathave only been strongly bon...

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Hauptverfasser:	ROBERT D. BROWN, JEREMY W. MCCUTCHEON
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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