THERMALLY ENHANCED SEMICONDUCTOR PACKAGE AND METHOD OF PRODUCING THE SAME

This invention includes a heat sink structure for use in a semiconductor package that includes a ring structure with down sets and a heat sink connected to the ring structure. The down sets can be slanted or V-shaped. The invention also includes a method of manufacturing a semiconductor package that...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SUN YI SHENG, ANTHONY, TAN HIEN BOON, RAVI KANTH KOLAN, LOW TSE HOONG, PATRICK, DANNY VALLEJO RETUTA, SUSANTO TANARY
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!