METHOD OF TEMPORARILY ATTACHING A RIGID CARRIER TO A SUBSTRATE
METHOD OF TEMPORARILY ATTACHING A RIGID CARRIER TO A SUBSTRATEMethod for temporarily attaching a substrates to a rigid carrier is described which includes forming a sacrificial layer of a thermally-decomposable polymer, e.g., poly(alkylene carbonate), and bonding the flexible substrate to the rigid...
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Schreiben Sie den ersten Kommentar!