SEMICONDUCTOR DEVICE

A semiconductor device 1 is equipped with a first substrate 3 on which a first semiconductor chip 2 is mounted, a second substrate 5 on which a second semiconductor chip 4is mounted, and connecting sections 6 that electrically connect the first substrate 3 and the second substrate 5. The first subst...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: YAMASHITA, HIROYUKI, KATSURAYAMA, SATORU, SUGINO, MITSUO
Format: Patent
Sprache:eng
Online-Zugang:Volltext bestellen
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