PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACKAGED MICROELECTRONIC DEVICES

Packaged microelectronic devices and methods of manufacturing packaged microelectronic devices are disclosed herein. In one embodiment, a method of manufacturing a microelectronic device includes forming a stand-off layer over a plurality of microelectronic dies on a semiconductor workpiece, and rem...

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Hauptverfasser:	CHEE TAY LIANG, HIONG LEOW SEE
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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