WIRE BONDING PROCESS FOR INSULATED WIRES

WIRE BONDING PROCESS FOR INSULATED WIRES

A process for bonding insulated wires is provided wherein a conforming free air ball is formed from an insulated wire to create a ball bond. A tip of the insulated wire is first positioned close to an electronic flame-off device and a first electric discharge is produced from the electronic flame-of...

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Hauptverfasser: MALLIAH RAMKUMAR, CHRISTOPHER CARR, VATH III CHARLES J, YOUNG-KYU SONG, ROBERT LYN, AIK LIM LOON, JOHN PERSIC
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Sprache:eng
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creator MALLIAH RAMKUMAR
CHRISTOPHER CARR
VATH III CHARLES J
YOUNG-KYU SONG
ROBERT LYN
AIK LIM LOON
JOHN PERSIC
description A process for bonding insulated wires is provided wherein a conforming free air ball is formed from an insulated wire to create a ball bond. A tip of the insulated wire is first positioned close to an electronic flame-off device and a first electric discharge is produced from the electronic flame-off device to melt the tip of the insulated wire and produce a pilot ball. The electric discharge is then terminated. A second electric discharge is then generated to produce the conforming free air ball, and thereafter, the conforming free air ball is attached to a bonding surface to create the ball bond.
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