3D ELECTRONIC PACKAGING STRUCTURE HAVING A CONDUCTIVE SUPPORT SUBSTRATE

3D ELECTRONIC PACKAGING STRUCTURE HAVING A CONDUCTIVE SUPPORT SUBSTRATE

The present invention provides a 3D electronic packaging unit having a conductive supporting substrate that can achieve multi-chip stacking through the signal contacts on the both sides of the unit. The packaging unit can be batched manufactured on wafers or substrates, and thus reduce the manufactu...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: CHOU CHAN-YEN, YEW MINGIH, CHIANG KOU-NING, YUAN CHANG-ANN
Format: Patent
Sprache:eng
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator CHOU CHAN-YEN
YEW MINGIH
CHIANG KOU-NING
YUAN CHANG-ANN
description The present invention provides a 3D electronic packaging unit having a conductive supporting substrate that can achieve multi-chip stacking through the signal contacts on the both sides of the unit. The packaging unit can be batched manufactured on wafers or substrates, and thus reduce the manufacturing cost of each individual packaging unit; moreover, the conductive supporting substrate can be utilized to provide signal transmission of the electronic elements, and the supporting substrate can be used as a ground terminal for the carried electronic elements to enhance electric performance of the electronic elements. The supporting substrate is also a good thermal conductor that can release effectively heat energy generated by the electronic elements and accumulated inside the package to the outside of the package along the substrate to enhance reliability of the packaging structure.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_SG153684A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>SG153684A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_SG153684A13</originalsourceid><addsrcrecordid>eNrjZHA3dlFw9XF1Dgny9_N0VghwdPZ2dPf0c1cIDgkKdQ4JDXJV8HAMAwk4Kjj7-7kAxTzDXBWCQwMC_INCgLQTUKFjiCsPA2taYk5xKi-U5maQd3MNcfbQTS3Ij08tLkhMTs1LLYkPdjc0NTazMHE0NCasAgA_vywV</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>3D ELECTRONIC PACKAGING STRUCTURE HAVING A CONDUCTIVE SUPPORT SUBSTRATE</title><source>esp@cenet</source><creator>CHOU CHAN-YEN ; YEW MINGIH ; CHIANG KOU-NING ; YUAN CHANG-ANN</creator><creatorcontrib>CHOU CHAN-YEN ; YEW MINGIH ; CHIANG KOU-NING ; YUAN CHANG-ANN</creatorcontrib><description>The present invention provides a 3D electronic packaging unit having a conductive supporting substrate that can achieve multi-chip stacking through the signal contacts on the both sides of the unit. The packaging unit can be batched manufactured on wafers or substrates, and thus reduce the manufacturing cost of each individual packaging unit; moreover, the conductive supporting substrate can be utilized to provide signal transmission of the electronic elements, and the supporting substrate can be used as a ground terminal for the carried electronic elements to enhance electric performance of the electronic elements. The supporting substrate is also a good thermal conductor that can release effectively heat energy generated by the electronic elements and accumulated inside the package to the outside of the package along the substrate to enhance reliability of the packaging structure.</description><language>eng</language><creationdate>2009</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20090729&amp;DB=EPODOC&amp;CC=SG&amp;NR=153684A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20090729&amp;DB=EPODOC&amp;CC=SG&amp;NR=153684A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHOU CHAN-YEN</creatorcontrib><creatorcontrib>YEW MINGIH</creatorcontrib><creatorcontrib>CHIANG KOU-NING</creatorcontrib><creatorcontrib>YUAN CHANG-ANN</creatorcontrib><title>3D ELECTRONIC PACKAGING STRUCTURE HAVING A CONDUCTIVE SUPPORT SUBSTRATE</title><description>The present invention provides a 3D electronic packaging unit having a conductive supporting substrate that can achieve multi-chip stacking through the signal contacts on the both sides of the unit. The packaging unit can be batched manufactured on wafers or substrates, and thus reduce the manufacturing cost of each individual packaging unit; moreover, the conductive supporting substrate can be utilized to provide signal transmission of the electronic elements, and the supporting substrate can be used as a ground terminal for the carried electronic elements to enhance electric performance of the electronic elements. The supporting substrate is also a good thermal conductor that can release effectively heat energy generated by the electronic elements and accumulated inside the package to the outside of the package along the substrate to enhance reliability of the packaging structure.</description><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2009</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHA3dlFw9XF1Dgny9_N0VghwdPZ2dPf0c1cIDgkKdQ4JDXJV8HAMAwk4Kjj7-7kAxTzDXBWCQwMC_INCgLQTUKFjiCsPA2taYk5xKi-U5maQd3MNcfbQTS3Ij08tLkhMTs1LLYkPdjc0NTazMHE0NCasAgA_vywV</recordid><startdate>20090729</startdate><enddate>20090729</enddate><creator>CHOU CHAN-YEN</creator><creator>YEW MINGIH</creator><creator>CHIANG KOU-NING</creator><creator>YUAN CHANG-ANN</creator><scope>EVB</scope></search><sort><creationdate>20090729</creationdate><title>3D ELECTRONIC PACKAGING STRUCTURE HAVING A CONDUCTIVE SUPPORT SUBSTRATE</title><author>CHOU CHAN-YEN ; YEW MINGIH ; CHIANG KOU-NING ; YUAN CHANG-ANN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_SG153684A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2009</creationdate><toplevel>online_resources</toplevel><creatorcontrib>CHOU CHAN-YEN</creatorcontrib><creatorcontrib>YEW MINGIH</creatorcontrib><creatorcontrib>CHIANG KOU-NING</creatorcontrib><creatorcontrib>YUAN CHANG-ANN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHOU CHAN-YEN</au><au>YEW MINGIH</au><au>CHIANG KOU-NING</au><au>YUAN CHANG-ANN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>3D ELECTRONIC PACKAGING STRUCTURE HAVING A CONDUCTIVE SUPPORT SUBSTRATE</title><date>2009-07-29</date><risdate>2009</risdate><abstract>The present invention provides a 3D electronic packaging unit having a conductive supporting substrate that can achieve multi-chip stacking through the signal contacts on the both sides of the unit. The packaging unit can be batched manufactured on wafers or substrates, and thus reduce the manufacturing cost of each individual packaging unit; moreover, the conductive supporting substrate can be utilized to provide signal transmission of the electronic elements, and the supporting substrate can be used as a ground terminal for the carried electronic elements to enhance electric performance of the electronic elements. The supporting substrate is also a good thermal conductor that can release effectively heat energy generated by the electronic elements and accumulated inside the package to the outside of the package along the substrate to enhance reliability of the packaging structure.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_SG153684A1
source esp@cenet
title 3D ELECTRONIC PACKAGING STRUCTURE HAVING A CONDUCTIVE SUPPORT SUBSTRATE
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-04T22%3A27%3A28IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=CHOU%20CHAN-YEN&rft.date=2009-07-29&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ESG153684A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true