Semiconductor component having chip on board leadframe and method of fabrication

Semiconductor component having chip on board leadframe and method of fabrication

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Hauptverfasser: LEE CHOON KUAN, DALSON YE SENG KIM, JEFFREY TOH TUCK FOOK
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator LEE CHOON KUAN
DALSON YE SENG KIM
JEFFREY TOH TUCK FOOK
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Semiconductor component having chip on board leadframe and method of fabrication
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