SUBSTRATE PROCESSING APPARATUS
A substrate processing apparatus includes a polishing section and a transport section. The polishing section has a first polishing unit, a second polishing unit, and a transport mechanism. The first polishing unit has a first polishing apparatus and a second polishing apparatus. The second polishing...
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| creator | SHINKAI Kenji MAEDA Koji YAMAGUCHI Kuniaki TAMURA Masayuki YOSHINARI Dai EHARA Shun ISOBE Soichi HAIYANG Xu ASANO Kentaro SHIMOMOTO Hiroshi ISOKAWA Hidetatsu |
| description | A substrate processing apparatus includes a polishing section and a transport section. The polishing section has a first polishing unit, a second polishing unit, and a transport mechanism. The first polishing unit has a first polishing apparatus and a second polishing apparatus. The second polishing unit has a third polishing apparatus and a fourth polishing apparatus. Each of the first to fourth polishing apparatuses has a polishing table to which a polishing pad is mounted, a top ring, and auxiliary units that perform a process on the polishing pad during polishing. Around the polishing table, a pair of auxiliary unit mounting units for mounting the respective auxiliary units in a left-right switchable manner with respect to a straight line connecting a swing center of the top ring and a center of rotation of the polishing table is provided at respective positions symmetrical with respect to the straight line. |
| format | Patent |
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The polishing section has a first polishing unit, a second polishing unit, and a transport mechanism. The first polishing unit has a first polishing apparatus and a second polishing apparatus. The second polishing unit has a third polishing apparatus and a fourth polishing apparatus. Each of the first to fourth polishing apparatuses has a polishing table to which a polishing pad is mounted, a top ring, and auxiliary units that perform a process on the polishing pad during polishing. Around the polishing table, a pair of auxiliary unit mounting units for mounting the respective auxiliary units in a left-right switchable manner with respect to a straight line connecting a swing center of the top ring and a center of rotation of the polishing table is provided at respective positions symmetrical with respect to the straight line.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; DRESSING OR CONDITIONING OF ABRADING SURFACES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; SEMICONDUCTOR DEVICES ; TRANSPORTING</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201029&DB=EPODOC&CC=SG&NR=11202009373PA$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201029&DB=EPODOC&CC=SG&NR=11202009373PA$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SHINKAI Kenji</creatorcontrib><creatorcontrib>MAEDA Koji</creatorcontrib><creatorcontrib>YAMAGUCHI Kuniaki</creatorcontrib><creatorcontrib>TAMURA Masayuki</creatorcontrib><creatorcontrib>YOSHINARI Dai</creatorcontrib><creatorcontrib>EHARA Shun</creatorcontrib><creatorcontrib>ISOBE Soichi</creatorcontrib><creatorcontrib>HAIYANG Xu</creatorcontrib><creatorcontrib>ASANO Kentaro</creatorcontrib><creatorcontrib>SHIMOMOTO Hiroshi</creatorcontrib><creatorcontrib>ISOKAWA Hidetatsu</creatorcontrib><title>SUBSTRATE PROCESSING APPARATUS</title><description>A substrate processing apparatus includes a polishing section and a transport section. The polishing section has a first polishing unit, a second polishing unit, and a transport mechanism. The first polishing unit has a first polishing apparatus and a second polishing apparatus. The second polishing unit has a third polishing apparatus and a fourth polishing apparatus. Each of the first to fourth polishing apparatuses has a polishing table to which a polishing pad is mounted, a top ring, and auxiliary units that perform a process on the polishing pad during polishing. Around the polishing table, a pair of auxiliary unit mounting units for mounting the respective auxiliary units in a left-right switchable manner with respect to a straight line connecting a swing center of the top ring and a center of rotation of the polishing table is provided at respective positions symmetrical with respect to the straight line.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJALDnUKDglyDHFVCAjyd3YNDvb0c1dwDAhwBIqFBvMwsKYl5hSn8kJpbgYVN9cQZw_d1IL8-NTigsTk1LzUkvhgd0NDIwMjAwNLY3PjAEdjIpUBAKKUIyA</recordid><startdate>20201029</startdate><enddate>20201029</enddate><creator>SHINKAI Kenji</creator><creator>MAEDA Koji</creator><creator>YAMAGUCHI Kuniaki</creator><creator>TAMURA Masayuki</creator><creator>YOSHINARI Dai</creator><creator>EHARA Shun</creator><creator>ISOBE Soichi</creator><creator>HAIYANG Xu</creator><creator>ASANO Kentaro</creator><creator>SHIMOMOTO Hiroshi</creator><creator>ISOKAWA Hidetatsu</creator><scope>EVB</scope></search><sort><creationdate>20201029</creationdate><title>SUBSTRATE PROCESSING APPARATUS</title><author>SHINKAI Kenji ; MAEDA Koji ; YAMAGUCHI Kuniaki ; TAMURA Masayuki ; YOSHINARI Dai ; EHARA Shun ; ISOBE Soichi ; HAIYANG Xu ; ASANO Kentaro ; SHIMOMOTO Hiroshi ; ISOKAWA Hidetatsu</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_SG11202009373PA3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2020</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>SHINKAI Kenji</creatorcontrib><creatorcontrib>MAEDA Koji</creatorcontrib><creatorcontrib>YAMAGUCHI Kuniaki</creatorcontrib><creatorcontrib>TAMURA Masayuki</creatorcontrib><creatorcontrib>YOSHINARI Dai</creatorcontrib><creatorcontrib>EHARA Shun</creatorcontrib><creatorcontrib>ISOBE Soichi</creatorcontrib><creatorcontrib>HAIYANG Xu</creatorcontrib><creatorcontrib>ASANO Kentaro</creatorcontrib><creatorcontrib>SHIMOMOTO Hiroshi</creatorcontrib><creatorcontrib>ISOKAWA Hidetatsu</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SHINKAI Kenji</au><au>MAEDA Koji</au><au>YAMAGUCHI Kuniaki</au><au>TAMURA Masayuki</au><au>YOSHINARI Dai</au><au>EHARA Shun</au><au>ISOBE Soichi</au><au>HAIYANG Xu</au><au>ASANO Kentaro</au><au>SHIMOMOTO Hiroshi</au><au>ISOKAWA Hidetatsu</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SUBSTRATE PROCESSING APPARATUS</title><date>2020-10-29</date><risdate>2020</risdate><abstract>A substrate processing apparatus includes a polishing section and a transport section. The polishing section has a first polishing unit, a second polishing unit, and a transport mechanism. The first polishing unit has a first polishing apparatus and a second polishing apparatus. The second polishing unit has a third polishing apparatus and a fourth polishing apparatus. Each of the first to fourth polishing apparatuses has a polishing table to which a polishing pad is mounted, a top ring, and auxiliary units that perform a process on the polishing pad during polishing. Around the polishing table, a pair of auxiliary unit mounting units for mounting the respective auxiliary units in a left-right switchable manner with respect to a straight line connecting a swing center of the top ring and a center of rotation of the polishing table is provided at respective positions symmetrical with respect to the straight line.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING |
| title | SUBSTRATE PROCESSING APPARATUS |
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