METHOD FOR POLISHING A SEMICONDUCTOR WAFER

Semiconductor wafers are polished simultaneously on both the front and the rear sides between an upper polishing plate and a lower polishing plate, each covered with a polishing pad, wherein a polishing gap (x1+x2) corresponding to a difference in the respective distances between facing surfaces of...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HEILMAIER, Alexander, DUTSCHKE, Vladimir, OLBRICH, Torsten, MEYER, Dirk, NG, Vincent, MISTUR, Leszek
Format:	Patent
Sprache:	eng
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING
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