PHOTOSENSITIVE RESIN COMPOSITION AND CURED PRODUCT OF SAME

The present invention is a negative photosensitive resin composition which contains (A) an epoxy resin, (B) a compound that has a phenolic hydroxyl group and (C) a cationic photopolymerization initiator. This negative photosensitive resin composition is configured such that: 30% by mass or more of t...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	KOUMOTO Taihei, HAKONE Yoshihiro, ONO Yoshiyuki, KOIZUMI Takanori
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES APPARATUS SPECIALLY ADAPTED THEREFOR CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON DYES ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MATERIALS THEREFOR METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PAINTS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The present invention is a negative photosensitive resin composition which contains (A) an epoxy resin, (B) a compound that has a phenolic hydroxyl group and (C) a cationic photopolymerization initiator. This negative photosensitive resin composition is configured such that: 30% by mass or more of the epoxy resin (A) is an epoxy resin (A-1) that is represented by formula (1) (wherein each R moiety independently represents a glycidyl group or a hydrogen atom, and at least two R moieties among the plurality of R moieties are glycidyl groups; and a represents the average of the number of repeating units, which is a real number within the range of from 0 to 30); and the compound (B) that has a phenolic hydroxyl group and the cationic photopolymerization initiator (C) have specific structures.