SOLAR CELL BONDING

A bonding apparatus includes a heat source, a first plate, a second plate, and an actuation mechanism. The first plate is coupled to the heat source. The first and second plates are thermally conductive and configured to cover an entire solar cell. The actuation mechanism moves the bonding apparatus...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHILD, Kent Riley, MURALI, Venkatesan, RUDIN, Arthur, DAM, Jesse, PRABHU, Gopal
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!