A THIN PLASTIC POLISHING ARTICLE FOR CMP APPLICATIONS
456 Z 466 r Z 476 / A 414 462 464 FIG. 4A 410 452 450 454 420 460 472 470 474 (12) INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 26 July 2018 (26.07.2018) WIP0 I PCT...
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| creator | WANG, You MENK, Gregory E TRAN, Huyen Karen GURUSAMY, Jay KAKIREDDY, Veera Raghava Reddy REDEKER, Fred C TOLLES, Robert D MIKHAYLICHENKO, Ekaterina DAVEY, Eric |
| description | 456 Z 466 r Z 476 / A 414 462 464 FIG. 4A 410 452 450 454 420 460 472 470 474 (12) INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 26 July 2018 (26.07.2018) WIP0 I PCT IiiimmoimiolollmonolomoilimoilimommovoimIE (10) International Publication Number WO 2018/136694 Al (51) International Patent Classification: B24B 21/06 (2006.01) B24B 37/26 (2012.01) B24B 21/12 (2006.01) B24D 11/00 (2006.01) B24B 37/12 (2012.01) (21) International Application Number: PCT/US2018/014344 (22) International Filing Date: 19 January 2018 (19.01.2018) (25) Filing Language: English (26) Publication Language: English (30) Priority Data: 62/448,747 20 January 2017 (20.01.2017) US 62/555,605 07 September 2017 (07.09.2017) US (71) Applicant: APPLIED MATERIALS, INC. [US/US]; 3050 Bowers Avenue, Santa Clara, California 95054 (US). (72) Inventors: TOLLES, Robert D.; 536 Losse Ct., San Jose, California 95110 (US). MENK, Gregory E.; 1833 Green- wood Road, Pleasanton, California 94566 (US). DAVEY, Eric; 248 Pamela Dr., Apt #35, Mountain View, Califor- nia 94040 (US). WANG, You; 22653 Queens Oak Court, Cupertino, California 95014 (US). TRAN, Huyen Karen; 73 S. 17th St., San Jose, California 95112 (US). RE- DEKER, Fred C.; 1801 Sioux Drive, Fremont, California 94536 (US). KAKIREDDY, Veera Raghava Reddy; 1620 Hope Dr., Apt.# 526, Santa Clara, California 95054 (US). MIKHAYLICHENKO, Ekaterina; 1818 Fumia Place, San Jose, California 95131 (US). GURUSAMY, Jay; 4058 Rivermark Parkway, Santa Clara, California 95054 (US). (54) Title: A THIN PLASTIC POLISHING ARTICLE FOR CMP APPLICATIONS 400 FIG 4E 449 j 447 448 I 412 (57) : A method and apparatus for polishing a substrate that includes a polishing article comprising a polymeric sheet having a raised surface texture, which is formed on the surface of the polymeric sheet is provided. According to one or more implementations of the present disclosure, an advanced polishing article has been developed, which does not require abrasive pad conditioning. In some implementations of the present disclosure, the advanced polishing article comprises a polymeric sheet having a polishing surface with a raised surface texture or \"micro-features\" and/or a plurality of grooves or \"macro-features\" formed in the polishing surface. In some implementations, the raised surface texture is embossed, etched, machined or otherwise formed in the |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_SG11201906131WA</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>SG11201906131WA</sourcerecordid><originalsourceid>FETCH-epo_espacenet_SG11201906131WA3</originalsourceid><addsrcrecordid>eNrjZDB1VAjx8PRTCPBxDA7xdFYI8PfxDAYKuCs4BgH5Pq4Kbv5BCs6-AQqOAQE-ns6OIZ7-fsE8DKxpiTnFqbxQmptBxc01xNlDN7UgPz61uCAxOTUvtSQ-2N3Q0MjA0NLAzNDYMNzRmEhlAMZtKPc</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>A THIN PLASTIC POLISHING ARTICLE FOR CMP APPLICATIONS</title><source>esp@cenet</source><creator>WANG, You ; MENK, Gregory E ; TRAN, Huyen Karen ; GURUSAMY, Jay ; KAKIREDDY, Veera Raghava Reddy ; REDEKER, Fred C ; TOLLES, Robert D ; MIKHAYLICHENKO, Ekaterina ; DAVEY, Eric</creator><creatorcontrib>WANG, You ; MENK, Gregory E ; TRAN, Huyen Karen ; GURUSAMY, Jay ; KAKIREDDY, Veera Raghava Reddy ; REDEKER, Fred C ; TOLLES, Robert D ; MIKHAYLICHENKO, Ekaterina ; DAVEY, Eric</creatorcontrib><description>456 Z 466 r Z 476 / A 414 462 464 FIG. 4A 410 452 450 454 420 460 472 470 474 (12) INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 26 July 2018 (26.07.2018) WIP0 I PCT IiiimmoimiolollmonolomoilimoilimommovoimIE (10) International Publication Number WO 2018/136694 Al (51) International Patent Classification: B24B 21/06 (2006.01) B24B 37/26 (2012.01) B24B 21/12 (2006.01) B24D 11/00 (2006.01) B24B 37/12 (2012.01) (21) International Application Number: PCT/US2018/014344 (22) International Filing Date: 19 January 2018 (19.01.2018) (25) Filing Language: English (26) Publication Language: English (30) Priority Data: 62/448,747 20 January 2017 (20.01.2017) US 62/555,605 07 September 2017 (07.09.2017) US (71) Applicant: APPLIED MATERIALS, INC. [US/US]; 3050 Bowers Avenue, Santa Clara, California 95054 (US). (72) Inventors: TOLLES, Robert D.; 536 Losse Ct., San Jose, California 95110 (US). MENK, Gregory E.; 1833 Green- wood Road, Pleasanton, California 94566 (US). DAVEY, Eric; 248 Pamela Dr., Apt #35, Mountain View, Califor- nia 94040 (US). WANG, You; 22653 Queens Oak Court, Cupertino, California 95014 (US). TRAN, Huyen Karen; 73 S. 17th St., San Jose, California 95112 (US). RE- DEKER, Fred C.; 1801 Sioux Drive, Fremont, California 94536 (US). KAKIREDDY, Veera Raghava Reddy; 1620 Hope Dr., Apt.# 526, Santa Clara, California 95054 (US). MIKHAYLICHENKO, Ekaterina; 1818 Fumia Place, San Jose, California 95131 (US). GURUSAMY, Jay; 4058 Rivermark Parkway, Santa Clara, California 95054 (US). (54) Title: A THIN PLASTIC POLISHING ARTICLE FOR CMP APPLICATIONS 400 FIG 4E 449 j 447 448 I 412 (57) : A method and apparatus for polishing a substrate that includes a polishing article comprising a polymeric sheet having a raised surface texture, which is formed on the surface of the polymeric sheet is provided. According to one or more implementations of the present disclosure, an advanced polishing article has been developed, which does not require abrasive pad conditioning. In some implementations of the present disclosure, the advanced polishing article comprises a polymeric sheet having a polishing surface with a raised surface texture or \"micro-features\" and/or a plurality of grooves or \"macro-features\" formed in the polishing surface. In some implementations, the raised surface texture is embossed, etched, machined or otherwise formed in the polishing surface prior to installing and using the advanced polishing article in a polishing system. In one implementation, the raised features have a height within one order of magnitude of the features removed from the substrate during polishing. [Continued on next page] WO 2018/136694 Al MIDEDIMOMOIDEIREEMOMMIMEDIEHOHMEHOIS (74) Agent: PATTERSON, B. Todd et al.; Patterson & Sheri- dan, L.L.P., 24 Greenway Plaza, Suite 1600, Houston, Texas 77046 (US). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Published: with international search report (Art. 21(3)) before the expiration of the time limit for amending the claims and to be republished in the event of receipt of amendments (Rule 48.2(h))</description><language>eng</language><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; TOOLS FOR GRINDING, BUFFING, OR SHARPENING ; TRANSPORTING</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190827&DB=EPODOC&CC=SG&NR=11201906131WA$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,778,883,25547,76298</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190827&DB=EPODOC&CC=SG&NR=11201906131WA$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>WANG, You</creatorcontrib><creatorcontrib>MENK, Gregory E</creatorcontrib><creatorcontrib>TRAN, Huyen Karen</creatorcontrib><creatorcontrib>GURUSAMY, Jay</creatorcontrib><creatorcontrib>KAKIREDDY, Veera Raghava Reddy</creatorcontrib><creatorcontrib>REDEKER, Fred C</creatorcontrib><creatorcontrib>TOLLES, Robert D</creatorcontrib><creatorcontrib>MIKHAYLICHENKO, Ekaterina</creatorcontrib><creatorcontrib>DAVEY, Eric</creatorcontrib><title>A THIN PLASTIC POLISHING ARTICLE FOR CMP APPLICATIONS</title><description>456 Z 466 r Z 476 / A 414 462 464 FIG. 4A 410 452 450 454 420 460 472 470 474 (12) INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 26 July 2018 (26.07.2018) WIP0 I PCT IiiimmoimiolollmonolomoilimoilimommovoimIE (10) International Publication Number WO 2018/136694 Al (51) International Patent Classification: B24B 21/06 (2006.01) B24B 37/26 (2012.01) B24B 21/12 (2006.01) B24D 11/00 (2006.01) B24B 37/12 (2012.01) (21) International Application Number: PCT/US2018/014344 (22) International Filing Date: 19 January 2018 (19.01.2018) (25) Filing Language: English (26) Publication Language: English (30) Priority Data: 62/448,747 20 January 2017 (20.01.2017) US 62/555,605 07 September 2017 (07.09.2017) US (71) Applicant: APPLIED MATERIALS, INC. [US/US]; 3050 Bowers Avenue, Santa Clara, California 95054 (US). (72) Inventors: TOLLES, Robert D.; 536 Losse Ct., San Jose, California 95110 (US). MENK, Gregory E.; 1833 Green- wood Road, Pleasanton, California 94566 (US). DAVEY, Eric; 248 Pamela Dr., Apt #35, Mountain View, Califor- nia 94040 (US). WANG, You; 22653 Queens Oak Court, Cupertino, California 95014 (US). TRAN, Huyen Karen; 73 S. 17th St., San Jose, California 95112 (US). RE- DEKER, Fred C.; 1801 Sioux Drive, Fremont, California 94536 (US). KAKIREDDY, Veera Raghava Reddy; 1620 Hope Dr., Apt.# 526, Santa Clara, California 95054 (US). MIKHAYLICHENKO, Ekaterina; 1818 Fumia Place, San Jose, California 95131 (US). GURUSAMY, Jay; 4058 Rivermark Parkway, Santa Clara, California 95054 (US). (54) Title: A THIN PLASTIC POLISHING ARTICLE FOR CMP APPLICATIONS 400 FIG 4E 449 j 447 448 I 412 (57) : A method and apparatus for polishing a substrate that includes a polishing article comprising a polymeric sheet having a raised surface texture, which is formed on the surface of the polymeric sheet is provided. According to one or more implementations of the present disclosure, an advanced polishing article has been developed, which does not require abrasive pad conditioning. In some implementations of the present disclosure, the advanced polishing article comprises a polymeric sheet having a polishing surface with a raised surface texture or \"micro-features\" and/or a plurality of grooves or \"macro-features\" formed in the polishing surface. In some implementations, the raised surface texture is embossed, etched, machined or otherwise formed in the polishing surface prior to installing and using the advanced polishing article in a polishing system. In one implementation, the raised features have a height within one order of magnitude of the features removed from the substrate during polishing. [Continued on next page] WO 2018/136694 Al MIDEDIMOMOIDEIREEMOMMIMEDIEHOHMEHOIS (74) Agent: PATTERSON, B. Todd et al.; Patterson & Sheri- dan, L.L.P., 24 Greenway Plaza, Suite 1600, Houston, Texas 77046 (US). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Published: with international search report (Art. 21(3)) before the expiration of the time limit for amending the claims and to be republished in the event of receipt of amendments (Rule 48.2(h))</description><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>TOOLS FOR GRINDING, BUFFING, OR SHARPENING</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDB1VAjx8PRTCPBxDA7xdFYI8PfxDAYKuCs4BgH5Pq4Kbv5BCs6-AQqOAQE-ns6OIZ7-fsE8DKxpiTnFqbxQmptBxc01xNlDN7UgPz61uCAxOTUvtSQ-2N3Q0MjA0NLAzNDYMNzRmEhlAMZtKPc</recordid><startdate>20190827</startdate><enddate>20190827</enddate><creator>WANG, You</creator><creator>MENK, Gregory E</creator><creator>TRAN, Huyen Karen</creator><creator>GURUSAMY, Jay</creator><creator>KAKIREDDY, Veera Raghava Reddy</creator><creator>REDEKER, Fred C</creator><creator>TOLLES, Robert D</creator><creator>MIKHAYLICHENKO, Ekaterina</creator><creator>DAVEY, Eric</creator><scope>EVB</scope></search><sort><creationdate>20190827</creationdate><title>A THIN PLASTIC POLISHING ARTICLE FOR CMP APPLICATIONS</title><author>WANG, You ; MENK, Gregory E ; TRAN, Huyen Karen ; GURUSAMY, Jay ; KAKIREDDY, Veera Raghava Reddy ; REDEKER, Fred C ; TOLLES, Robert D ; MIKHAYLICHENKO, Ekaterina ; DAVEY, Eric</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_SG11201906131WA3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2019</creationdate><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>TOOLS FOR GRINDING, BUFFING, OR SHARPENING</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>WANG, You</creatorcontrib><creatorcontrib>MENK, Gregory E</creatorcontrib><creatorcontrib>TRAN, Huyen Karen</creatorcontrib><creatorcontrib>GURUSAMY, Jay</creatorcontrib><creatorcontrib>KAKIREDDY, Veera Raghava Reddy</creatorcontrib><creatorcontrib>REDEKER, Fred C</creatorcontrib><creatorcontrib>TOLLES, Robert D</creatorcontrib><creatorcontrib>MIKHAYLICHENKO, Ekaterina</creatorcontrib><creatorcontrib>DAVEY, Eric</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>WANG, You</au><au>MENK, Gregory E</au><au>TRAN, Huyen Karen</au><au>GURUSAMY, Jay</au><au>KAKIREDDY, Veera Raghava Reddy</au><au>REDEKER, Fred C</au><au>TOLLES, Robert D</au><au>MIKHAYLICHENKO, Ekaterina</au><au>DAVEY, Eric</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>A THIN PLASTIC POLISHING ARTICLE FOR CMP APPLICATIONS</title><date>2019-08-27</date><risdate>2019</risdate><abstract>456 Z 466 r Z 476 / A 414 462 464 FIG. 4A 410 452 450 454 420 460 472 470 474 (12) INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 26 July 2018 (26.07.2018) WIP0 I PCT IiiimmoimiolollmonolomoilimoilimommovoimIE (10) International Publication Number WO 2018/136694 Al (51) International Patent Classification: B24B 21/06 (2006.01) B24B 37/26 (2012.01) B24B 21/12 (2006.01) B24D 11/00 (2006.01) B24B 37/12 (2012.01) (21) International Application Number: PCT/US2018/014344 (22) International Filing Date: 19 January 2018 (19.01.2018) (25) Filing Language: English (26) Publication Language: English (30) Priority Data: 62/448,747 20 January 2017 (20.01.2017) US 62/555,605 07 September 2017 (07.09.2017) US (71) Applicant: APPLIED MATERIALS, INC. [US/US]; 3050 Bowers Avenue, Santa Clara, California 95054 (US). (72) Inventors: TOLLES, Robert D.; 536 Losse Ct., San Jose, California 95110 (US). MENK, Gregory E.; 1833 Green- wood Road, Pleasanton, California 94566 (US). DAVEY, Eric; 248 Pamela Dr., Apt #35, Mountain View, Califor- nia 94040 (US). WANG, You; 22653 Queens Oak Court, Cupertino, California 95014 (US). TRAN, Huyen Karen; 73 S. 17th St., San Jose, California 95112 (US). RE- DEKER, Fred C.; 1801 Sioux Drive, Fremont, California 94536 (US). KAKIREDDY, Veera Raghava Reddy; 1620 Hope Dr., Apt.# 526, Santa Clara, California 95054 (US). MIKHAYLICHENKO, Ekaterina; 1818 Fumia Place, San Jose, California 95131 (US). GURUSAMY, Jay; 4058 Rivermark Parkway, Santa Clara, California 95054 (US). (54) Title: A THIN PLASTIC POLISHING ARTICLE FOR CMP APPLICATIONS 400 FIG 4E 449 j 447 448 I 412 (57) : A method and apparatus for polishing a substrate that includes a polishing article comprising a polymeric sheet having a raised surface texture, which is formed on the surface of the polymeric sheet is provided. According to one or more implementations of the present disclosure, an advanced polishing article has been developed, which does not require abrasive pad conditioning. In some implementations of the present disclosure, the advanced polishing article comprises a polymeric sheet having a polishing surface with a raised surface texture or \"micro-features\" and/or a plurality of grooves or \"macro-features\" formed in the polishing surface. In some implementations, the raised surface texture is embossed, etched, machined or otherwise formed in the polishing surface prior to installing and using the advanced polishing article in a polishing system. In one implementation, the raised features have a height within one order of magnitude of the features removed from the substrate during polishing. [Continued on next page] WO 2018/136694 Al MIDEDIMOMOIDEIREEMOMMIMEDIEHOHMEHOIS (74) Agent: PATTERSON, B. Todd et al.; Patterson & Sheri- dan, L.L.P., 24 Greenway Plaza, Suite 1600, Houston, Texas 77046 (US). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Published: with international search report (Art. 21(3)) before the expiration of the time limit for amending the claims and to be republished in the event of receipt of amendments (Rule 48.2(h))</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING |
| title | A THIN PLASTIC POLISHING ARTICLE FOR CMP APPLICATIONS |
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