FIRST PROTECTIVE FILM FORMING SHEET

FIRST PROTECTIVE FILM FORMING SHEET

A first protective film forming sheet includes a first base member, a buffer layer formed on the first base member, and a curable resin film formed on the buffer layer, in which test pieces having a diameter of 8 mm and a thickness of 1 mm are prepared for the 2325 buffer layer and the curable resin...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: ADACHI Issei, YAMAGISHI Masanori
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator ADACHI Issei
YAMAGISHI Masanori
description A first protective film forming sheet includes a first base member, a buffer layer formed on the first base member, and a curable resin film formed on the buffer layer, in which test pieces having a diameter of 8 mm and a thickness of 1 mm are prepared for the 2325 buffer layer and the curable resin film and the distortion is caused to occur on the test piece under the conditions of the temperature of 90°C and the frequency of 1 Hz so as to perform a distortion dispersion measurement for measuring the shear modulus G' of the test piece. At this time, a shear modulus Gb300' of the test piece of the buffer layer when the distortion of the test piece of the buffer layer is 300% and a shear modulus 2330 Gc300' of the test piece of the curable resin film when the distortion of the test piece of the curable resin film is 300% satisfy a relationship represented by Gb300' ≥ Gc300'. Fig. 3.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_SG11201902955QA</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>SG11201902955QA</sourcerecordid><originalsourceid>FETCH-epo_espacenet_SG11201902955QA3</originalsourceid><addsrcrecordid>eNrjZFB28wwKDlEICPIPcXUO8QxzVXDz9PFVcPMP8vX0c1cI9nB1DeFhYE1LzClO5YXS3Awqbq4hzh66qQX58anFBYnJqXmpJfHB7oaGRgaGlgZGlqamgY7GRCoDADfbJEo</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>FIRST PROTECTIVE FILM FORMING SHEET</title><source>esp@cenet</source><creator>ADACHI Issei ; YAMAGISHI Masanori</creator><creatorcontrib>ADACHI Issei ; YAMAGISHI Masanori</creatorcontrib><description>A first protective film forming sheet includes a first base member, a buffer layer formed on the first base member, and a curable resin film formed on the buffer layer, in which test pieces having a diameter of 8 mm and a thickness of 1 mm are prepared for the 2325 buffer layer and the curable resin film and the distortion is caused to occur on the test piece under the conditions of the temperature of 90°C and the frequency of 1 Hz so as to perform a distortion dispersion measurement for measuring the shear modulus G' of the test piece. At this time, a shear modulus Gb300' of the test piece of the buffer layer when the distortion of the test piece of the buffer layer is 300% and a shear modulus 2330 Gc300' of the test piece of the curable resin film when the distortion of the test piece of the curable resin film is 300% satisfy a relationship represented by Gb300' ≥ Gc300'. Fig. 3.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20190530&amp;DB=EPODOC&amp;CC=SG&amp;NR=11201902955QA$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20190530&amp;DB=EPODOC&amp;CC=SG&amp;NR=11201902955QA$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ADACHI Issei</creatorcontrib><creatorcontrib>YAMAGISHI Masanori</creatorcontrib><title>FIRST PROTECTIVE FILM FORMING SHEET</title><description>A first protective film forming sheet includes a first base member, a buffer layer formed on the first base member, and a curable resin film formed on the buffer layer, in which test pieces having a diameter of 8 mm and a thickness of 1 mm are prepared for the 2325 buffer layer and the curable resin film and the distortion is caused to occur on the test piece under the conditions of the temperature of 90°C and the frequency of 1 Hz so as to perform a distortion dispersion measurement for measuring the shear modulus G' of the test piece. At this time, a shear modulus Gb300' of the test piece of the buffer layer when the distortion of the test piece of the buffer layer is 300% and a shear modulus 2330 Gc300' of the test piece of the curable resin film when the distortion of the test piece of the curable resin film is 300% satisfy a relationship represented by Gb300' ≥ Gc300'. Fig. 3.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFB28wwKDlEICPIPcXUO8QxzVXDz9PFVcPMP8vX0c1cI9nB1DeFhYE1LzClO5YXS3Awqbq4hzh66qQX58anFBYnJqXmpJfHB7oaGRgaGlgZGlqamgY7GRCoDADfbJEo</recordid><startdate>20190530</startdate><enddate>20190530</enddate><creator>ADACHI Issei</creator><creator>YAMAGISHI Masanori</creator><scope>EVB</scope></search><sort><creationdate>20190530</creationdate><title>FIRST PROTECTIVE FILM FORMING SHEET</title><author>ADACHI Issei ; YAMAGISHI Masanori</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_SG11201902955QA3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2019</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>ADACHI Issei</creatorcontrib><creatorcontrib>YAMAGISHI Masanori</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ADACHI Issei</au><au>YAMAGISHI Masanori</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>FIRST PROTECTIVE FILM FORMING SHEET</title><date>2019-05-30</date><risdate>2019</risdate><abstract>A first protective film forming sheet includes a first base member, a buffer layer formed on the first base member, and a curable resin film formed on the buffer layer, in which test pieces having a diameter of 8 mm and a thickness of 1 mm are prepared for the 2325 buffer layer and the curable resin film and the distortion is caused to occur on the test piece under the conditions of the temperature of 90°C and the frequency of 1 Hz so as to perform a distortion dispersion measurement for measuring the shear modulus G' of the test piece. At this time, a shear modulus Gb300' of the test piece of the buffer layer when the distortion of the test piece of the buffer layer is 300% and a shear modulus 2330 Gc300' of the test piece of the curable resin film when the distortion of the test piece of the curable resin film is 300% satisfy a relationship represented by Gb300' ≥ Gc300'. Fig. 3.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_SG11201902955QA
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title FIRST PROTECTIVE FILM FORMING SHEET
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-25T06%3A02%3A07IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=ADACHI%20Issei&rft.date=2019-05-30&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ESG11201902955QA%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true