POSITIVE WORKING PHOTOSENSITIVE MATERIAL

The present application for patent relates to a light-sensitive positive working photosensitive composition especially useful for imaging thick films using a composition which gives very good film uniformity and promotes a good process latitude against feature pattern collapse in patterns created up...

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Hauptverfasser: HISHIDA, Aritaka, LAI, SookMee, LU, PingHung, LIU, Weihong, CHEN, Chunwei, SAKURAI, YOSHIHARU
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creator HISHIDA, Aritaka
LAI, SookMee
LU, PingHung
LIU, Weihong
CHEN, Chunwei
SAKURAI, YOSHIHARU
description The present application for patent relates to a light-sensitive positive working photosensitive composition especially useful for imaging thick films using a composition which gives very good film uniformity and promotes a good process latitude against feature pattern collapse in patterns created upon imaging and developing of these films.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_SG11201806670RA</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>SG11201806670RA</sourcerecordid><originalsourceid>FETCH-epo_espacenet_SG11201806670RA3</originalsourceid><addsrcrecordid>eNrjZNAI8A_2DPEMc1UI9w_y9vRzVwjw8A_xD3b1gwr7Ooa4Bnk6-vAwsKYl5hSn8kJpbgYVN9cQZw_d1IL8-NTigsTk1LzUkvhgd0NDIwNDCwMzM3ODIEdjIpUBAB80JhI</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>POSITIVE WORKING PHOTOSENSITIVE MATERIAL</title><source>esp@cenet</source><creator>HISHIDA, Aritaka ; LAI, SookMee ; LU, PingHung ; LIU, Weihong ; CHEN, Chunwei ; SAKURAI, YOSHIHARU</creator><creatorcontrib>HISHIDA, Aritaka ; LAI, SookMee ; LU, PingHung ; LIU, Weihong ; CHEN, Chunwei ; SAKURAI, YOSHIHARU</creatorcontrib><description>The present application for patent relates to a light-sensitive positive working photosensitive composition especially useful for imaging thick films using a composition which gives very good film uniformity and promotes a good process latitude against feature pattern collapse in patterns created upon imaging and developing of these films.</description><language>eng</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; CINEMATOGRAPHY ; ELECTROGRAPHY ; HOLOGRAPHY ; MATERIALS THEREFOR ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20180927&amp;DB=EPODOC&amp;CC=SG&amp;NR=11201806670RA$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20180927&amp;DB=EPODOC&amp;CC=SG&amp;NR=11201806670RA$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HISHIDA, Aritaka</creatorcontrib><creatorcontrib>LAI, SookMee</creatorcontrib><creatorcontrib>LU, PingHung</creatorcontrib><creatorcontrib>LIU, Weihong</creatorcontrib><creatorcontrib>CHEN, Chunwei</creatorcontrib><creatorcontrib>SAKURAI, YOSHIHARU</creatorcontrib><title>POSITIVE WORKING PHOTOSENSITIVE MATERIAL</title><description>The present application for patent relates to a light-sensitive positive working photosensitive composition especially useful for imaging thick films using a composition which gives very good film uniformity and promotes a good process latitude against feature pattern collapse in patterns created upon imaging and developing of these films.</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>CINEMATOGRAPHY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MATERIALS THEREFOR</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAI8A_2DPEMc1UI9w_y9vRzVwjw8A_xD3b1gwr7Ooa4Bnk6-vAwsKYl5hSn8kJpbgYVN9cQZw_d1IL8-NTigsTk1LzUkvhgd0NDIwNDCwMzM3ODIEdjIpUBAB80JhI</recordid><startdate>20180927</startdate><enddate>20180927</enddate><creator>HISHIDA, Aritaka</creator><creator>LAI, SookMee</creator><creator>LU, PingHung</creator><creator>LIU, Weihong</creator><creator>CHEN, Chunwei</creator><creator>SAKURAI, YOSHIHARU</creator><scope>EVB</scope></search><sort><creationdate>20180927</creationdate><title>POSITIVE WORKING PHOTOSENSITIVE MATERIAL</title><author>HISHIDA, Aritaka ; LAI, SookMee ; LU, PingHung ; LIU, Weihong ; CHEN, Chunwei ; SAKURAI, YOSHIHARU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_SG11201806670RA3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2018</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>CINEMATOGRAPHY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MATERIALS THEREFOR</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><toplevel>online_resources</toplevel><creatorcontrib>HISHIDA, Aritaka</creatorcontrib><creatorcontrib>LAI, SookMee</creatorcontrib><creatorcontrib>LU, PingHung</creatorcontrib><creatorcontrib>LIU, Weihong</creatorcontrib><creatorcontrib>CHEN, Chunwei</creatorcontrib><creatorcontrib>SAKURAI, YOSHIHARU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HISHIDA, Aritaka</au><au>LAI, SookMee</au><au>LU, PingHung</au><au>LIU, Weihong</au><au>CHEN, Chunwei</au><au>SAKURAI, YOSHIHARU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>POSITIVE WORKING PHOTOSENSITIVE MATERIAL</title><date>2018-09-27</date><risdate>2018</risdate><abstract>The present application for patent relates to a light-sensitive positive working photosensitive composition especially useful for imaging thick films using a composition which gives very good film uniformity and promotes a good process latitude against feature pattern collapse in patterns created upon imaging and developing of these films.</abstract><oa>free_for_read</oa></addata></record>
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source esp@cenet
subjects APPARATUS SPECIALLY ADAPTED THEREFOR
CINEMATOGRAPHY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
title POSITIVE WORKING PHOTOSENSITIVE MATERIAL
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-25T22%3A22%3A01IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=HISHIDA,%20Aritaka&rft.date=2018-09-27&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ESG11201806670RA%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true