METHOD OF PEELING ELECTRONIC MEMBER AND LAMINATE

METHOD OF PEELING ELECTRONIC MEMBER AND LAMINATE

Provided is a method of peeling an electronic member (16) from a laminate (10) composed of the electronic member (16) adhered to a supporting substrate (12) via an adhesive film (14), the adhesive film (14) having a self-peeling adhesive layer (17) on a surface located on the side of the supporting...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: IGARASHI KOUJI, USUGI SHINICHI, MORIMOTO AKIMITSU
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator IGARASHI KOUJI
USUGI SHINICHI
MORIMOTO AKIMITSU
description Provided is a method of peeling an electronic member (16) from a laminate (10) composed of the electronic member (16) adhered to a supporting substrate (12) via an adhesive film (14), the adhesive film (14) having a self-peeling adhesive layer (17) on a surface located on the side of the supporting substrate (12) and an exposed region A in at least one part of a surface (14a) which is located on the side of the electronic member (16). The method includes: a step of reducing adhesive strength between the supporting substrate (12) and the self-peeling adhesive layer (17) in the region A by applying energy on the region A; a step of removing the supporting substrate (a) from the laminate by further applying energy on the region and thus further reducing the adhesive strength reduced in the prior step between the supporting substrate (a) and the self-peeling adhesive layer from a starting point of the interface between the supporting substrate (a) and the self-peeling adhesive layer; and a step of peeling the electronic member (16) from the laminate by removing the adhesive film (14) from the electronic member (16).
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_SG11201509300PA</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>SG11201509300PA</sourcerecordid><originalsourceid>FETCH-epo_espacenet_SG11201509300PA3</originalsourceid><addsrcrecordid>eNrjZDDwdQ3x8HdR8HdTCHB19fH0c1dw9XF1Dgny9_N0VvB19XVyDVJw9HNR8HH09fRzDHHlYWBNS8wpTuWF0twMKm6uIc4euqkF-fGpxQWJyal5qSXxwe6GhkYGhqYGlsYGBgGOxkQqAwDrLidT</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METHOD OF PEELING ELECTRONIC MEMBER AND LAMINATE</title><source>esp@cenet</source><creator>IGARASHI KOUJI ; USUGI SHINICHI ; MORIMOTO AKIMITSU</creator><creatorcontrib>IGARASHI KOUJI ; USUGI SHINICHI ; MORIMOTO AKIMITSU</creatorcontrib><description>Provided is a method of peeling an electronic member (16) from a laminate (10) composed of the electronic member (16) adhered to a supporting substrate (12) via an adhesive film (14), the adhesive film (14) having a self-peeling adhesive layer (17) on a surface located on the side of the supporting substrate (12) and an exposed region A in at least one part of a surface (14a) which is located on the side of the electronic member (16). The method includes: a step of reducing adhesive strength between the supporting substrate (12) and the self-peeling adhesive layer (17) in the region A by applying energy on the region A; a step of removing the supporting substrate (a) from the laminate by further applying energy on the region and thus further reducing the adhesive strength reduced in the prior step between the supporting substrate (a) and the self-peeling adhesive layer from a starting point of the interface between the supporting substrate (a) and the self-peeling adhesive layer; and a step of peeling the electronic member (16) from the laminate by removing the adhesive film (14) from the electronic member (16).</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2015</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20151230&amp;DB=EPODOC&amp;CC=SG&amp;NR=11201509300PA$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20151230&amp;DB=EPODOC&amp;CC=SG&amp;NR=11201509300PA$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>IGARASHI KOUJI</creatorcontrib><creatorcontrib>USUGI SHINICHI</creatorcontrib><creatorcontrib>MORIMOTO AKIMITSU</creatorcontrib><title>METHOD OF PEELING ELECTRONIC MEMBER AND LAMINATE</title><description>Provided is a method of peeling an electronic member (16) from a laminate (10) composed of the electronic member (16) adhered to a supporting substrate (12) via an adhesive film (14), the adhesive film (14) having a self-peeling adhesive layer (17) on a surface located on the side of the supporting substrate (12) and an exposed region A in at least one part of a surface (14a) which is located on the side of the electronic member (16). The method includes: a step of reducing adhesive strength between the supporting substrate (12) and the self-peeling adhesive layer (17) in the region A by applying energy on the region A; a step of removing the supporting substrate (a) from the laminate by further applying energy on the region and thus further reducing the adhesive strength reduced in the prior step between the supporting substrate (a) and the self-peeling adhesive layer from a starting point of the interface between the supporting substrate (a) and the self-peeling adhesive layer; and a step of peeling the electronic member (16) from the laminate by removing the adhesive film (14) from the electronic member (16).</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2015</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDDwdQ3x8HdR8HdTCHB19fH0c1dw9XF1Dgny9_N0VvB19XVyDVJw9HNR8HH09fRzDHHlYWBNS8wpTuWF0twMKm6uIc4euqkF-fGpxQWJyal5qSXxwe6GhkYGhqYGlsYGBgGOxkQqAwDrLidT</recordid><startdate>20151230</startdate><enddate>20151230</enddate><creator>IGARASHI KOUJI</creator><creator>USUGI SHINICHI</creator><creator>MORIMOTO AKIMITSU</creator><scope>EVB</scope></search><sort><creationdate>20151230</creationdate><title>METHOD OF PEELING ELECTRONIC MEMBER AND LAMINATE</title><author>IGARASHI KOUJI ; USUGI SHINICHI ; MORIMOTO AKIMITSU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_SG11201509300PA3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2015</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>IGARASHI KOUJI</creatorcontrib><creatorcontrib>USUGI SHINICHI</creatorcontrib><creatorcontrib>MORIMOTO AKIMITSU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>IGARASHI KOUJI</au><au>USUGI SHINICHI</au><au>MORIMOTO AKIMITSU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD OF PEELING ELECTRONIC MEMBER AND LAMINATE</title><date>2015-12-30</date><risdate>2015</risdate><abstract>Provided is a method of peeling an electronic member (16) from a laminate (10) composed of the electronic member (16) adhered to a supporting substrate (12) via an adhesive film (14), the adhesive film (14) having a self-peeling adhesive layer (17) on a surface located on the side of the supporting substrate (12) and an exposed region A in at least one part of a surface (14a) which is located on the side of the electronic member (16). The method includes: a step of reducing adhesive strength between the supporting substrate (12) and the self-peeling adhesive layer (17) in the region A by applying energy on the region A; a step of removing the supporting substrate (a) from the laminate by further applying energy on the region and thus further reducing the adhesive strength reduced in the prior step between the supporting substrate (a) and the self-peeling adhesive layer from a starting point of the interface between the supporting substrate (a) and the self-peeling adhesive layer; and a step of peeling the electronic member (16) from the laminate by removing the adhesive film (14) from the electronic member (16).</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_SG11201509300PA
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title METHOD OF PEELING ELECTRONIC MEMBER AND LAMINATE
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-09T11%3A51%3A39IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=IGARASHI%20KOUJI&rft.date=2015-12-30&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ESG11201509300PA%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true