CURABLE COMPOSITION, ARTICLES COMPRISING THE CURABLE COMPOSITION, AND METHOD OF MAKING THE SAME

CURABLE COMPOSITION, ARTICLES COMPRISING THE CURABLE COMPOSITION, AND METHOD OF MAKING THE SAME

A curable composition includes polyepoxide, high-melting metal particles having a melting point above 300° C., low-melting metallic particles having a melting point of less than or equal to 300° C., and a fluxing curing agent comprising a fluxing curing agent comprising: a hydroxyalkyl-substituted t...

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1. Verfasser: LARSON, ERIC G
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Sprache:eng
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AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
GENERAL PROCESSES OF COMPOUNDING
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
WORKING-UP
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creator LARSON, ERIC G
description A curable composition includes polyepoxide, high-melting metal particles having a melting point above 300° C., low-melting metallic particles having a melting point of less than or equal to 300° C., and a fluxing curing agent comprising a fluxing curing agent comprising: a hydroxyalkyl-substituted tertiary amine, and at least one diacid compound represented by the formula: HO2C-Z1-CH2CH2CH2-Z2-CO2H wherein Z1 and Z2 independently represent a covalent bond or an aliphatic hydrocarbylene group. The at least one diacid compound comprises at least 50 percent of the total weight of carboxylic acids and anhydrides present in the curable composition. Articles comprising the curable composition, and methods of making the same are also disclosed.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_SG11201407112UA</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>SG11201407112UA</sourcerecordid><originalsourceid>FETCH-epo_espacenet_SG11201407112UA3</originalsourceid><addsrcrecordid>eNrjZIh3Dg1ydPJxVXD29w3wD_YM8fT301FwDArxdPZxDQaLBnkGe_q5K4R4ABVhVeznouDrGuLh76Lg76bg6-gNUx3s6OvKw8CalphTnMoLpbkZVNxcQ5w9dFML8uNTiwsSk1PzUkvig90NDY0MDE0MzIF0qKMxkcoAazg0Rg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>CURABLE COMPOSITION, ARTICLES COMPRISING THE CURABLE COMPOSITION, AND METHOD OF MAKING THE SAME</title><source>esp@cenet</source><creator>LARSON, ERIC G</creator><creatorcontrib>LARSON, ERIC G</creatorcontrib><description>A curable composition includes polyepoxide, high-melting metal particles having a melting point above 300° C., low-melting metallic particles having a melting point of less than or equal to 300° C., and a fluxing curing agent comprising a fluxing curing agent comprising: a hydroxyalkyl-substituted tertiary amine, and at least one diacid compound represented by the formula: HO2C-Z1-CH2CH2CH2-Z2-CO2H wherein Z1 and Z2 independently represent a covalent bond or an aliphatic hydrocarbylene group. The at least one diacid compound comprises at least 50 percent of the total weight of carboxylic acids and anhydrides present in the curable composition. Articles comprising the curable composition, and methods of making the same are also disclosed.</description><language>eng</language><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; GENERAL PROCESSES OF COMPOUNDING ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS ; WORKING-UP</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20141127&amp;DB=EPODOC&amp;CC=SG&amp;NR=11201407112UA$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20141127&amp;DB=EPODOC&amp;CC=SG&amp;NR=11201407112UA$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LARSON, ERIC G</creatorcontrib><title>CURABLE COMPOSITION, ARTICLES COMPRISING THE CURABLE COMPOSITION, AND METHOD OF MAKING THE SAME</title><description>A curable composition includes polyepoxide, high-melting metal particles having a melting point above 300° C., low-melting metallic particles having a melting point of less than or equal to 300° C., and a fluxing curing agent comprising a fluxing curing agent comprising: a hydroxyalkyl-substituted tertiary amine, and at least one diacid compound represented by the formula: HO2C-Z1-CH2CH2CH2-Z2-CO2H wherein Z1 and Z2 independently represent a covalent bond or an aliphatic hydrocarbylene group. The at least one diacid compound comprises at least 50 percent of the total weight of carboxylic acids and anhydrides present in the curable composition. Articles comprising the curable composition, and methods of making the same are also disclosed.</description><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>GENERAL PROCESSES OF COMPOUNDING</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><subject>WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2014</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZIh3Dg1ydPJxVXD29w3wD_YM8fT301FwDArxdPZxDQaLBnkGe_q5K4R4ABVhVeznouDrGuLh76Lg76bg6-gNUx3s6OvKw8CalphTnMoLpbkZVNxcQ5w9dFML8uNTiwsSk1PzUkvig90NDY0MDE0MzIF0qKMxkcoAazg0Rg</recordid><startdate>20141127</startdate><enddate>20141127</enddate><creator>LARSON, ERIC G</creator><scope>EVB</scope></search><sort><creationdate>20141127</creationdate><title>CURABLE COMPOSITION, ARTICLES COMPRISING THE CURABLE COMPOSITION, AND METHOD OF MAKING THE SAME</title><author>LARSON, ERIC G</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_SG11201407112UA3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2014</creationdate><topic>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>GENERAL PROCESSES OF COMPOUNDING</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><topic>WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>LARSON, ERIC G</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LARSON, ERIC G</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CURABLE COMPOSITION, ARTICLES COMPRISING THE CURABLE COMPOSITION, AND METHOD OF MAKING THE SAME</title><date>2014-11-27</date><risdate>2014</risdate><abstract>A curable composition includes polyepoxide, high-melting metal particles having a melting point above 300° C., low-melting metallic particles having a melting point of less than or equal to 300° C., and a fluxing curing agent comprising a fluxing curing agent comprising: a hydroxyalkyl-substituted tertiary amine, and at least one diacid compound represented by the formula: HO2C-Z1-CH2CH2CH2-Z2-CO2H wherein Z1 and Z2 independently represent a covalent bond or an aliphatic hydrocarbylene group. The at least one diacid compound comprises at least 50 percent of the total weight of carboxylic acids and anhydrides present in the curable composition. Articles comprising the curable composition, and methods of making the same are also disclosed.</abstract><oa>free_for_read</oa></addata></record>
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subjects AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
GENERAL PROCESSES OF COMPOUNDING
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
WORKING-UP
title CURABLE COMPOSITION, ARTICLES COMPRISING THE CURABLE COMPOSITION, AND METHOD OF MAKING THE SAME
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-28T17%3A00%3A23IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=LARSON,%20ERIC%20G&rft.date=2014-11-27&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ESG11201407112UA%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true