APPARATUSES AND METHODS FOR BONDING SUBSTRATES

An apparatus for joining substrates including a rotating drum. The drum may include an outer circumferential surface and a drum aperture in the drum outer circumferential surface. The drum may be configured to continuously advance substrates. A fluid nozzle may be moveably connected to the drum and...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: ORDWAY, DAVID, CARLTON, SCHNEIDER, UWE
Format: Patent
Sprache:eng
Schlagworte:
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