PLATING APPARATUS AND PLATING METHOD

PLATING APPARATUS AND PLATING METHOD

PLATING APPARATUS AND PLATING METHOD A plating apparatus for plating a substrate is provided to reduce vibration of a paddle. The plating apparatus includes a plating bath configured to accommodate plating solution; a paddle that is arranged in the plating bath, and configured to move in a reciproca...

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Hauptverfasser: Masashi SHIMOYAMA, Tsutomu NAKADA, Jumpei FUJIKATA, Yasuyuki MASUDA, SHAO HUA CHANG
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Sprache:eng
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creator Masashi SHIMOYAMA
Tsutomu NAKADA
Jumpei FUJIKATA
Yasuyuki MASUDA
SHAO HUA CHANG
description PLATING APPARATUS AND PLATING METHOD A plating apparatus for plating a substrate is provided to reduce vibration of a paddle. The plating apparatus includes a plating bath configured to accommodate plating solution; a paddle that is arranged in the plating bath, and configured to move in a reciprocating direction along a surface of the substrate to stir the plating solution; a support member for supporting a first end portion of the paddle; a first magnet provided on the paddle; and a second magnet provided on the plating bath. The first magnet and the second magnet are configured to exert a magnetic force on each other so that a second end portion on an opposite side to the first end portion of the paddle is suppressed from vibrating in directions approaching and leaving the substrate while the paddle is moving. Representative drawing: Fig. 8
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title PLATING APPARATUS AND PLATING METHOD
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