DUAL MODE CHAMBER FOR PROCESSING WAFER-SHAPED ARTICLES

An apparatus for processing a wafer shaped article comprises a rotary chuck for holding a wafer shaped article and rotating the wafer shaped article about an axis of rotation. A chamber surrounds and encloses the rotary chuck, the chamber comprising an upper opening. A lid is mounted externally of t...

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Bibliographische Detailangaben

Hauptverfasser:	KARL-HEINZ HOHENWARTER, MICHAEL PUGGL, MILAN PLISKA, REINHOLD SCHWARZENBACHER
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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