CONNECTOR MODULE
A connector module (102) includes a housing (108) and a conductive lead frame (110). The housing includes a cover (122) and a base (124) that define a cavity (120) therebetween. The cavity (120) receives a circuit card (106) therein. The base (124) has a top side (126) and a bottom side (128). The t...
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creator | CAMPBELL, CRAIG MAURICE MALSTROM, CHARLES RANDALL SARRAF, DAVID BRUCE MICHAEL FREDRICK LAUB |
description | A connector module (102) includes a housing (108) and a conductive lead frame (110). The housing includes a cover (122) and a base (124) that define a cavity (120) therebetween. The cavity (120) receives a circuit card (106) therein. The base (124) has a top side (126) and a bottom side (128). The top side (126) faces the cover (122) and defines part of the cavity (120). Multiple windows (130) extend through the base (124) between the top and bottom sides (126, 128). The base (124) includes a conductive layer (154) at least partially covered by a non-conductive layer (164). The conductive lead frame (110) is coupled to the bottom side (128) of the base (124). The lead frame (110) includes multiple contact beams (112) that extend into the cavity (120) through the windows (130) of the base (124). The lead frame (110) is electrically isolated from the conductive layer (154) of the base (124) by the non-conductive layer (164) of the base (124). The lead frame (110) further includes mounting contacts (114) configured to be mounted to conductive components (116) of a circuit board (104). |
format | Patent |
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The housing includes a cover (122) and a base (124) that define a cavity (120) therebetween. The cavity (120) receives a circuit card (106) therein. The base (124) has a top side (126) and a bottom side (128). The top side (126) faces the cover (122) and defines part of the cavity (120). Multiple windows (130) extend through the base (124) between the top and bottom sides (126, 128). The base (124) includes a conductive layer (154) at least partially covered by a non-conductive layer (164). The conductive lead frame (110) is coupled to the bottom side (128) of the base (124). The lead frame (110) includes multiple contact beams (112) that extend into the cavity (120) through the windows (130) of the base (124). The lead frame (110) is electrically isolated from the conductive layer (154) of the base (124) by the non-conductive layer (164) of the base (124). The lead frame (110) further includes mounting contacts (114) configured to be mounted to conductive components (116) of a circuit board (104).</abstract><oa>free_for_read</oa></addata></record> |
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title | CONNECTOR MODULE |
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