ABRASIVE PROCESSING METHOD

The present invention provides an apparatus and method for processing a component surface by abrading the component surface using an abrasive surface. The apparatus comprises an abrasive surface which is rotatable about an axis extending parallel to said component surface. A support is provided for...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: WEE, ARTHUR, TEO, WEE KIN, ANDREOU, RICHARD
Format: Patent
Sprache:eng
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!