ABRASIVE PROCESSING METHOD

The present invention provides an apparatus and method for processing a component surface by abrading the component surface using an abrasive surface. The apparatus comprises an abrasive surface which is rotatable about an axis extending parallel to said component surface. A support is provided for...

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Hauptverfasser: WEE, ARTHUR, TEO, WEE KIN, ANDREOU, RICHARD
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Sprache:eng
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creator WEE, ARTHUR
TEO, WEE KIN
ANDREOU, RICHARD
description The present invention provides an apparatus and method for processing a component surface by abrading the component surface using an abrasive surface. The apparatus comprises an abrasive surface which is rotatable about an axis extending parallel to said component surface. A support is provided for moving the abrasive surface or the component surface along a computer-generated toolpath and for applying a force between the abrasive surface and the component surface. The support increases the force between the abrasive surface and the component surface from a minimum force to a maximum force as the distance along the toolpath increases to maintain constant material removal from the component surface.
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title ABRASIVE PROCESSING METHOD
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