SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

Package substrate, semiconductor packages and methods for forming a semiconductor package are presented. The package substrate includes a base substrate having first and second major surfaces and a plurality of via contacts extending through the first to the second major surfaces of the base substra...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	CHUEN KHIANG WANG
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!