Semiconductor die offset compensation variation
A method and system for improving an automated pick and place apparatus semiconductor device placement process is provided. The method includes automatically executing a shift measurement associated with an offset from an original placement of a plurality of semiconductor die of a semiconductor wafe...
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | COOTS, Charles Andrew PICHURA, John Joseph FACTOUROVICH, Maxim |
| description | A method and system for improving an automated pick and place apparatus semiconductor device placement process is provided. The method includes automatically executing a shift measurement associated with an offset from an original placement of a plurality of semiconductor die of a semiconductor wafer for processing. An associated shift measurement value is retrieved and stored in a database that includes previously retrieved shift measurement values of previously measured shift measurements. Specified models are executed with respect to all shift measurement values and a predicted shift measurement value associated with a future offset for a new plurality of semiconductor die on a new semiconductor wafer for processing is determined. Placement hardware of the pick and place apparatus is placed in multiple positions for generating the new plurality of semiconductor die on the new semiconductor wafer in accordance with the predicted shift measurement value. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_SE544800C2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>SE544800C2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_SE544800C23</originalsourceid><addsrcrecordid>eNrjZNAPTs3NTM7PSylNLskvUkjJTFXIT0srTi1RSM7PLUjNK04syczPUyhLLMoEs3gYWNMSc4pTeaE0N4O8m2uIs4duakF-fGpxQWJyal5qSXywq6mJiYWBgbORMWEVAMtnKsc</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Semiconductor die offset compensation variation</title><source>esp@cenet</source><creator>COOTS, Charles Andrew ; PICHURA, John Joseph ; FACTOUROVICH, Maxim</creator><creatorcontrib>COOTS, Charles Andrew ; PICHURA, John Joseph ; FACTOUROVICH, Maxim</creatorcontrib><description>A method and system for improving an automated pick and place apparatus semiconductor device placement process is provided. The method includes automatically executing a shift measurement associated with an offset from an original placement of a plurality of semiconductor die of a semiconductor wafer for processing. An associated shift measurement value is retrieved and stored in a database that includes previously retrieved shift measurement values of previously measured shift measurements. Specified models are executed with respect to all shift measurement values and a predicted shift measurement value associated with a future offset for a new plurality of semiconductor die on a new semiconductor wafer for processing is determined. Placement hardware of the pick and place apparatus is placed in multiple positions for generating the new plurality of semiconductor die on the new semiconductor wafer in accordance with the predicted shift measurement value.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CALCULATING ; COMPUTING ; COUNTING ; ELECTRIC DIGITAL DATA PROCESSING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; PHYSICS ; SEMICONDUCTOR DEVICES</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221122&DB=EPODOC&CC=SE&NR=544800C2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221122&DB=EPODOC&CC=SE&NR=544800C2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>COOTS, Charles Andrew</creatorcontrib><creatorcontrib>PICHURA, John Joseph</creatorcontrib><creatorcontrib>FACTOUROVICH, Maxim</creatorcontrib><title>Semiconductor die offset compensation variation</title><description>A method and system for improving an automated pick and place apparatus semiconductor device placement process is provided. The method includes automatically executing a shift measurement associated with an offset from an original placement of a plurality of semiconductor die of a semiconductor wafer for processing. An associated shift measurement value is retrieved and stored in a database that includes previously retrieved shift measurement values of previously measured shift measurements. Specified models are executed with respect to all shift measurement values and a predicted shift measurement value associated with a future offset for a new plurality of semiconductor die on a new semiconductor wafer for processing is determined. Placement hardware of the pick and place apparatus is placed in multiple positions for generating the new plurality of semiconductor die on the new semiconductor wafer in accordance with the predicted shift measurement value.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CALCULATING</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>ELECTRIC DIGITAL DATA PROCESSING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAPTs3NTM7PSylNLskvUkjJTFXIT0srTi1RSM7PLUjNK04syczPUyhLLMoEs3gYWNMSc4pTeaE0N4O8m2uIs4duakF-fGpxQWJyal5qSXywq6mJiYWBgbORMWEVAMtnKsc</recordid><startdate>20221122</startdate><enddate>20221122</enddate><creator>COOTS, Charles Andrew</creator><creator>PICHURA, John Joseph</creator><creator>FACTOUROVICH, Maxim</creator><scope>EVB</scope></search><sort><creationdate>20221122</creationdate><title>Semiconductor die offset compensation variation</title><author>COOTS, Charles Andrew ; PICHURA, John Joseph ; FACTOUROVICH, Maxim</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_SE544800C23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CALCULATING</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>ELECTRIC DIGITAL DATA PROCESSING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>COOTS, Charles Andrew</creatorcontrib><creatorcontrib>PICHURA, John Joseph</creatorcontrib><creatorcontrib>FACTOUROVICH, Maxim</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>COOTS, Charles Andrew</au><au>PICHURA, John Joseph</au><au>FACTOUROVICH, Maxim</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Semiconductor die offset compensation variation</title><date>2022-11-22</date><risdate>2022</risdate><abstract>A method and system for improving an automated pick and place apparatus semiconductor device placement process is provided. The method includes automatically executing a shift measurement associated with an offset from an original placement of a plurality of semiconductor die of a semiconductor wafer for processing. An associated shift measurement value is retrieved and stored in a database that includes previously retrieved shift measurement values of previously measured shift measurements. Specified models are executed with respect to all shift measurement values and a predicted shift measurement value associated with a future offset for a new plurality of semiconductor die on a new semiconductor wafer for processing is determined. Placement hardware of the pick and place apparatus is placed in multiple positions for generating the new plurality of semiconductor die on the new semiconductor wafer in accordance with the predicted shift measurement value.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_SE544800C2 |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS CALCULATING COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PHYSICS SEMICONDUCTOR DEVICES |
| title | Semiconductor die offset compensation variation |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-03T20%3A50%3A32IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=COOTS,%20Charles%20Andrew&rft.date=2022-11-22&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ESE544800C2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |