Wet etching of substrate involves arranging on the substrate a passivating substance comprising active substance reacting with component contained in etchant to form etch protecting compound

A substrate is wet etched by arranging a passivating substance on the substrate (1) to define a pattern. The passivating substance comprises an active substance reacting with a component contained in the etchant (4) to form an etch-protecting component. Wet etching of a substrate involves applying a...

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Hauptverfasser: BJARNI BJARNASON, PER PETERSSON
Format: Patent
Sprache:eng ; swe
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