Wet etching of substrate involves arranging on the substrate a passivating substance comprising active substance reacting with component contained in etchant to form etch protecting compound
A substrate is wet etched by arranging a passivating substance on the substrate (1) to define a pattern. The passivating substance comprises an active substance reacting with a component contained in the etchant (4) to form an etch-protecting component. Wet etching of a substrate involves applying a...
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| creator | BJARNI BJARNASON PER PETERSSON |
| description | A substrate is wet etched by arranging a passivating substance on the substrate (1) to define a pattern. The passivating substance comprises an active substance reacting with a component contained in the etchant (4) to form an etch-protecting component. Wet etching of a substrate involves applying an etchant for etching the substrate in a given pattern. A passivating substance is arranged on the substrate to define the pattern. It forms an etch-protecting compound, which defines the pattern during etching. It comprises an active substance reacting with a component, which during etching is contained in the etchant solution, to form the etch-protecting compound. The active substance comprises ions that are soluble in the etchant and which form a compound, which is at least difficult to dissolve in the solution, with the component. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_SE517275C2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>SE517275C2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_SE517275C23</originalsourceid><addsrcrecordid>eNqFjjEOwjAMRbswIOAM-AIMFFU9ACpiB4mxMqnbRmqdKHHD7TgbaWDoxmT7vW_Z6-z9IAES1WvuwLTgp6cXh0KgOZghkAd0DrlLnkF6WmQQLHqvA8qsE0dWBMqM1mk_Q1SiAy2coxlF89LSp6RhYokdC2qmJl5OH2GEYqA1bkwzWGeEvrtpbeJmm61aHDztfnWT7S_V_Xw9kDU1eYuKmKS-VcWxzMvinJ_-Jz6Uk2F6</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Wet etching of substrate involves arranging on the substrate a passivating substance comprising active substance reacting with component contained in etchant to form etch protecting compound</title><source>esp@cenet</source><creator>BJARNI BJARNASON ; PER PETERSSON</creator><creatorcontrib>BJARNI BJARNASON ; PER PETERSSON</creatorcontrib><description>A substrate is wet etched by arranging a passivating substance on the substrate (1) to define a pattern. The passivating substance comprises an active substance reacting with a component contained in the etchant (4) to form an etch-protecting component. Wet etching of a substrate involves applying an etchant for etching the substrate in a given pattern. A passivating substance is arranged on the substrate to define the pattern. It forms an etch-protecting compound, which defines the pattern during etching. It comprises an active substance reacting with a component, which during etching is contained in the etchant solution, to form the etch-protecting compound. The active substance comprises ions that are soluble in the etchant and which form a compound, which is at least difficult to dissolve in the solution, with the component.</description><edition>7</edition><language>eng ; swe</language><subject>APPARATUS THEREFOR ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 ; NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE ; PRINTED CIRCUITS ; PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROMOBJECTS</subject><creationdate>2002</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20020521&DB=EPODOC&CC=SE&NR=517275C2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20020521&DB=EPODOC&CC=SE&NR=517275C2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>BJARNI BJARNASON</creatorcontrib><creatorcontrib>PER PETERSSON</creatorcontrib><title>Wet etching of substrate involves arranging on the substrate a passivating substance comprising active substance reacting with component contained in etchant to form etch protecting compound</title><description>A substrate is wet etched by arranging a passivating substance on the substrate (1) to define a pattern. The passivating substance comprises an active substance reacting with a component contained in the etchant (4) to form an etch-protecting component. Wet etching of a substrate involves applying an etchant for etching the substrate in a given pattern. A passivating substance is arranged on the substrate to define the pattern. It forms an etch-protecting compound, which defines the pattern during etching. It comprises an active substance reacting with a component, which during etching is contained in the etchant solution, to form the etch-protecting compound. The active substance comprises ions that are soluble in the etchant and which form a compound, which is at least difficult to dissolve in the solution, with the component.</description><subject>APPARATUS THEREFOR</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25</subject><subject>NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE</subject><subject>PRINTED CIRCUITS</subject><subject>PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROMOBJECTS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2002</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqFjjEOwjAMRbswIOAM-AIMFFU9ACpiB4mxMqnbRmqdKHHD7TgbaWDoxmT7vW_Z6-z9IAES1WvuwLTgp6cXh0KgOZghkAd0DrlLnkF6WmQQLHqvA8qsE0dWBMqM1mk_Q1SiAy2coxlF89LSp6RhYokdC2qmJl5OH2GEYqA1bkwzWGeEvrtpbeJmm61aHDztfnWT7S_V_Xw9kDU1eYuKmKS-VcWxzMvinJ_-Jz6Uk2F6</recordid><startdate>20020521</startdate><enddate>20020521</enddate><creator>BJARNI BJARNASON</creator><creator>PER PETERSSON</creator><scope>EVB</scope></search><sort><creationdate>20020521</creationdate><title>Wet etching of substrate involves arranging on the substrate a passivating substance comprising active substance reacting with component contained in etchant to form etch protecting compound</title><author>BJARNI BJARNASON ; PER PETERSSON</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_SE517275C23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; swe</language><creationdate>2002</creationdate><topic>APPARATUS THEREFOR</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25</topic><topic>NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE</topic><topic>PRINTED CIRCUITS</topic><topic>PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROMOBJECTS</topic><toplevel>online_resources</toplevel><creatorcontrib>BJARNI BJARNASON</creatorcontrib><creatorcontrib>PER PETERSSON</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>BJARNI BJARNASON</au><au>PER PETERSSON</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Wet etching of substrate involves arranging on the substrate a passivating substance comprising active substance reacting with component contained in etchant to form etch protecting compound</title><date>2002-05-21</date><risdate>2002</risdate><abstract>A substrate is wet etched by arranging a passivating substance on the substrate (1) to define a pattern. The passivating substance comprises an active substance reacting with a component contained in the etchant (4) to form an etch-protecting component. Wet etching of a substrate involves applying an etchant for etching the substrate in a given pattern. A passivating substance is arranged on the substrate to define the pattern. It forms an etch-protecting compound, which defines the pattern during etching. It comprises an active substance reacting with a component, which during etching is contained in the etchant solution, to form the etch-protecting compound. The active substance comprises ions that are soluble in the etchant and which form a compound, which is at least difficult to dissolve in the solution, with the component.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| language | eng ; swe |
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| subjects | APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROMOBJECTS |
| title | Wet etching of substrate involves arranging on the substrate a passivating substance comprising active substance reacting with component contained in etchant to form etch protecting compound |
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