Trådbondningskompensering

A hybrid circuit and a process for the manufacturing of a hybrid circuit (11) have been provided, the circuit comprising a component (2) such as a monolithic integrated circuit, MIC, and a substrate (1), being arranged on a common carrier plate (6), the substrate and component having respective term...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SANDRO VECCHIATTINI, BJOERN ALBINSSON, ROY BERGQVIST
Format:	Patent
Sprache:	swe
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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