FORFARANDE FOR ATT UNDVIKA OONSKADE KOPPARAVSETTNINGAR VID STROMLOS KOPPARPLETERING
The metallic surfaces of plating equipment in use during electroless copper deposition, such as vessels 2, racks 26 supporting substrates 24 to be plated, plumbing are rendered substantially resistant to electroless copper deposition for extended periods by initially imposing on such equipment surfa...
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Patent |
| Sprache: | swe |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | R J ZEBLISKY |
| description | The metallic surfaces of plating equipment in use during electroless copper deposition, such as vessels 2, racks 26 supporting substrates 24 to be plated, plumbing are rendered substantially resistant to electroless copper deposition for extended periods by initially imposing on such equipment surfaces an electrical potential via power supply 10 more positive than the mixed potential of the electroless copper deposition solution and sufficiently positive to resist electroless deposition. The workpiece substrate 24 is insulated from rack 26 by non-conductor 27. The electrical potential supplied by electrode 6 and the vessel walls 12a, 12b, is monitored during the electroless plating using reference electrode 22. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_SE453925B</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>SE453925B</sourcerecordid><originalsourceid>FETCH-epo_espacenet_SE453925B3</originalsourceid><addsrcrecordid>eNrjZAh28w9ycwxy9HNxVQAyFRxDQhRC_VzCPL0dFfz9_YK9HYES3v4BAUA1YcGuISF-nn7ujkEKYZ4uCsEhQf6-Pv7BUPkAH9cQ1yCgNA8Da1piTnEqL5TmZpBzcw1x9tBNLciPTy0uSExOzUstiQ92NTE1tjQydTImqAAANJYvag</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>FORFARANDE FOR ATT UNDVIKA OONSKADE KOPPARAVSETTNINGAR VID STROMLOS KOPPARPLETERING</title><source>esp@cenet</source><creator>R J ZEBLISKY</creator><creatorcontrib>R J ZEBLISKY</creatorcontrib><description>The metallic surfaces of plating equipment in use during electroless copper deposition, such as vessels 2, racks 26 supporting substrates 24 to be plated, plumbing are rendered substantially resistant to electroless copper deposition for extended periods by initially imposing on such equipment surfaces an electrical potential via power supply 10 more positive than the mixed potential of the electroless copper deposition solution and sufficiently positive to resist electroless deposition. The workpiece substrate 24 is insulated from rack 26 by non-conductor 27. The electrical potential supplied by electrode 6 and the vessel walls 12a, 12b, is monitored during the electroless plating using reference electrode 22.</description><edition>4</edition><language>swe</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 ; NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE ; PRINTED CIRCUITS ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>1988</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19880314&DB=EPODOC&CC=SE&NR=453925B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19880314&DB=EPODOC&CC=SE&NR=453925B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>R J ZEBLISKY</creatorcontrib><title>FORFARANDE FOR ATT UNDVIKA OONSKADE KOPPARAVSETTNINGAR VID STROMLOS KOPPARPLETERING</title><description>The metallic surfaces of plating equipment in use during electroless copper deposition, such as vessels 2, racks 26 supporting substrates 24 to be plated, plumbing are rendered substantially resistant to electroless copper deposition for extended periods by initially imposing on such equipment surfaces an electrical potential via power supply 10 more positive than the mixed potential of the electroless copper deposition solution and sufficiently positive to resist electroless deposition. The workpiece substrate 24 is insulated from rack 26 by non-conductor 27. The electrical potential supplied by electrode 6 and the vessel walls 12a, 12b, is monitored during the electroless plating using reference electrode 22.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25</subject><subject>NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE</subject><subject>PRINTED CIRCUITS</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1988</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZAh28w9ycwxy9HNxVQAyFRxDQhRC_VzCPL0dFfz9_YK9HYES3v4BAUA1YcGuISF-nn7ujkEKYZ4uCsEhQf6-Pv7BUPkAH9cQ1yCgNA8Da1piTnEqL5TmZpBzcw1x9tBNLciPTy0uSExOzUstiQ92NTE1tjQydTImqAAANJYvag</recordid><startdate>19880314</startdate><enddate>19880314</enddate><creator>R J ZEBLISKY</creator><scope>EVB</scope></search><sort><creationdate>19880314</creationdate><title>FORFARANDE FOR ATT UNDVIKA OONSKADE KOPPARAVSETTNINGAR VID STROMLOS KOPPARPLETERING</title><author>R J ZEBLISKY</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_SE453925B3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>swe</language><creationdate>1988</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25</topic><topic>NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE</topic><topic>PRINTED CIRCUITS</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>R J ZEBLISKY</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>R J ZEBLISKY</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>FORFARANDE FOR ATT UNDVIKA OONSKADE KOPPARAVSETTNINGAR VID STROMLOS KOPPARPLETERING</title><date>1988-03-14</date><risdate>1988</risdate><abstract>The metallic surfaces of plating equipment in use during electroless copper deposition, such as vessels 2, racks 26 supporting substrates 24 to be plated, plumbing are rendered substantially resistant to electroless copper deposition for extended periods by initially imposing on such equipment surfaces an electrical potential via power supply 10 more positive than the mixed potential of the electroless copper deposition solution and sufficiently positive to resist electroless deposition. The workpiece substrate 24 is insulated from rack 26 by non-conductor 27. The electrical potential supplied by electrode 6 and the vessel walls 12a, 12b, is monitored during the electroless plating using reference electrode 22.</abstract><edition>4</edition><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | swe |
| recordid | cdi_epo_espacenet_SE453925B |
| source | esp@cenet |
| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE PRINTED CIRCUITS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | FORFARANDE FOR ATT UNDVIKA OONSKADE KOPPARAVSETTNINGAR VID STROMLOS KOPPARPLETERING |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-05T21%3A35%3A15IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=R%20J%20ZEBLISKY&rft.date=1988-03-14&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ESE453925B%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |