KOMPONENTSKIVA

1429078 Circuit assemblies; mounting integrated circuits BUNKER RAMO CORP 25 April 1973 [27 April 1972] 19715/73 Headings H1B and H1K A component wafer 121, for use in a multilevel, stacked wafer circuit structure, comprises a component 401, e.g. an integrated circuit chip, sealed and embedded within a cavity 205 formed in a base member of insulating material 200, e.g. ceramic, a number of spaced solid conductive slugs 286 in a uniform pattern in the base member 200 extending between the surfaces thereof, and conductive interconnections, including the conductors 254, disposed wholly within the base member 200 recessed from both surfaces thereof and extending substantially parallel to the plane of the base member to provide a direct electrical connection, wholly within the base member, of the respective slugs 286 to the output terminals 401a of the component 401. As shown the base member 200 may be formed of a number of layers of ceramic and the cavity 205 therein includes a step 205c which supports the sealing cap 210 flush with the surface of the base member. A further step 205b in the cavity is provided with terminal pads 207 which are connected to the conductors 254 disposed within the ceramic base member and interconnecting wires 206 provide connection between the pads 207 and the component terminals 401a. When stacked, the component wafer 121 may be disposed adjacent a connecting wafer (16), Figs. 3 and 4 (not shown), comprising a conductive sheet (90) having a uniform pattern of conductive slugs (86) extending therethrough which are insulated from the remainder of the sheet by dielectric material (88) and which are aligned with the slugs 286 in wafer 121 and have conductive malleable contacts (96) disposed thereon. When stacked under pressure the malleable contacts ensure good connections between the slugs of adjacent wafers. A second pattern of slugs 298 may be provided in the component wafer 121 aligned with a second set of malleable contacts (98) on portions of the conducting surface of the connecting wafer not containing slugs (86) to maintain wafer-to-wafer ground connection within the stack.