METHOD FOR MANUFACTURING OF MULTILEVEL COPPER METALLISATION WITH ULTRALOW VALUE OF DIELECTRIC CONSTANT FOR INTRALAYER INSULATION

FIELD: electricity.SUBSTANCE: invention is referred to manufacturing technology of multilevel metallisation for very large integrated circuits (VLIC). The method for manufacturing of multilevel copper metallisation for VLIC with multiple repetitions of processes for manufacturing of standard structu...

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Hauptverfasser:	KRASNIKOV GENNADIJ JAKOVLEVICH, GVOZDEV VLADIMIR ALEKSANDROVICH, VALEEV ADIL' SALIKHOVICH, KUZNETSOV PAVEL IGOREVICH
Format:	Patent
Sprache:	eng ; rus
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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