METHOD FOR MANUFACTURING CONTACTLESS CHIP-CARD AND CHIP-CARD

FIELD: contactless chip-card and method for manufacturing contactless chip-cards. ^ SUBSTANCE: plastic substrate, which has notches, is prepared. Antenna coil is placed on the top side of plastic substrate. Construct, which has integrated chips, is placed on the back side of plastic substrate, oppos...

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Hauptverfasser: PROSKE RAJNKHARD, SHTAMPKA PETER, PJUSHNER FRANK, MJULLER-KHIPPER ANDREAS
Format: Patent
Sprache:eng ; rus
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Zusammenfassung:FIELD: contactless chip-card and method for manufacturing contactless chip-cards. ^ SUBSTANCE: plastic substrate, which has notches, is prepared. Antenna coil is placed on the top side of plastic substrate. Construct, which has integrated chips, is placed on the back side of plastic substrate, opposite to top side. Electrical connection is created between coil and construct. Plastic substrate is placed into press mold for die casting. Card body is produced by die casting on the back side of plastic substrate. ^ EFFECT: manufacturing contactless chip-card, improvement of method for manufacturing chip-card, simplicity and efficiency of method, exclusion damage to built into chip-card antenna coil. ^ 7 cl, 2 dwg