EPOXY COMPOSITION

FIELD: military industry, in particular tank artillery. ^ SUBSTANCE: invention relates to epoxy composition useful as adhesive for fast joining parts from polyamide material. Claimed composition contains (wt %): epoxy diatomaceous resin 64.8-68.4; polyethylene polyamine 9.0-11.0; epoxy aliphatic res...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	ZAGITOV A.M, AMARANTOV G.N, NOVOZHILOVA O.N, GERASIMOV V.I, LETOV B.P, BAKHTINA I.A, MANANOV G.N, TALALAEV A.P, ALBUTOVA R.E, ARTEMOVA O.V, KRASIL'NIKOV F.S, KHVOROSTOVA S.V, AREF'EV V.S, MEZHERITSKIJ S.EH
Format:	Patent
Sprache:	eng ; rus
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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