METHOD OF REJECTING MICROJOINTS OF SEMICONDUCTOR ARTICLES

FIELD: electric engineering; method of rejecting inner microjoints of semiconductor instruments and device. ^ SUBSTANCE: according to proposed method, microjoint is acted upon by jet of compressed air. In process of blowing, semiconductor article is connected to static parameters automatic control i...

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Bibliographische Detailangaben
Hauptverfasser: SEGAL JU.E, GORLOV M.I, BELJAEV V.N, ZENIN V.V, BOKAREV D.I
Format: Patent
Sprache:eng ; rus
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Zusammenfassung:FIELD: electric engineering; method of rejecting inner microjoints of semiconductor instruments and device. ^ SUBSTANCE: according to proposed method, microjoint is acted upon by jet of compressed air. In process of blowing, semiconductor article is connected to static parameters automatic control instrument maximum tolerable voltage is applied to article and, at leakage current equal to zero, defective microjoints in article are revealed. ^ EFFECT: reduced labor input at inspection and checking. ^ 2 cl, 1 dwg