TOTALLY SEALED MICROELECTRONIC UNIT

microelectronic engineering. SUBSTANCE: totally sealed microelectronic unit used for electric circuits of radio electronic devices distinguished by functionally nonuniform composition and intricate morphology of interconnections of parts and circuit components has case divided by means of partitions...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: BALANDIN V.S, ZHIGUNOV O.D, IVANOV V.P, NIKOL'TSEV V.A, IVANOV E.G, LAPTEV JU.P, BARANOV JU.I, KORZHAVIN G.A, PRIKHODCHENKO V.A
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator BALANDIN V.S
ZHIGUNOV O.D
IVANOV V.P
NIKOL'TSEV V.A
IVANOV E.G
LAPTEV JU.P
BARANOV JU.I
KORZHAVIN G.A
PRIKHODCHENKO V.A
description microelectronic engineering. SUBSTANCE: totally sealed microelectronic unit used for electric circuits of radio electronic devices distinguished by functionally nonuniform composition and intricate morphology of interconnections of parts and circuit components has case divided by means of partitions into compartments, cover soldered to case over its perimeter, sealing assembly, and stuffing arrangements. Case is monolithic structure built integral with partitions; its area as viewed on top is at least 100 sq. cm. Degree of sealing with respect to helium leakage is between cm2 and 10-4 to 10-3 l Pa/s. Partitions have bulges that function as stops for additional case-to-cover fixation by compound-sealed screws. Cover underside depressions made at cover-to-partitions mating points accommodate contact springs. EFFECT: improved reliability at high integration of large structural levels of devices. 8 cl, 5 dwg
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_RU2155462C1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>RU2155462C1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_RU2155462C13</originalsourceid><addsrcrecordid>eNrjZFAO8Q9x9PGJVAh2dfRxdVHw9XQO8nf1cXUOCfL383RWCPXzDOFhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfFBoUaGpqYmZkbOhsZEKAEAL1wipQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>TOTALLY SEALED MICROELECTRONIC UNIT</title><source>esp@cenet</source><creator>BALANDIN V.S ; ZHIGUNOV O.D ; IVANOV V.P ; NIKOL'TSEV V.A ; IVANOV E.G ; LAPTEV JU.P ; BARANOV JU.I ; KORZHAVIN G.A ; PRIKHODCHENKO V.A</creator><creatorcontrib>BALANDIN V.S ; ZHIGUNOV O.D ; IVANOV V.P ; NIKOL'TSEV V.A ; IVANOV E.G ; LAPTEV JU.P ; BARANOV JU.I ; KORZHAVIN G.A ; PRIKHODCHENKO V.A</creatorcontrib><description>microelectronic engineering. SUBSTANCE: totally sealed microelectronic unit used for electric circuits of radio electronic devices distinguished by functionally nonuniform composition and intricate morphology of interconnections of parts and circuit components has case divided by means of partitions into compartments, cover soldered to case over its perimeter, sealing assembly, and stuffing arrangements. Case is monolithic structure built integral with partitions; its area as viewed on top is at least 100 sq. cm. Degree of sealing with respect to helium leakage is between cm2 and 10-4 to 10-3 l Pa/s. Partitions have bulges that function as stops for additional case-to-cover fixation by compound-sealed screws. Cover underside depressions made at cover-to-partitions mating points accommodate contact springs. EFFECT: improved reliability at high integration of large structural levels of devices. 8 cl, 5 dwg</description><edition>7</edition><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2000</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20000827&amp;DB=EPODOC&amp;CC=RU&amp;NR=2155462C1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20000827&amp;DB=EPODOC&amp;CC=RU&amp;NR=2155462C1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>BALANDIN V.S</creatorcontrib><creatorcontrib>ZHIGUNOV O.D</creatorcontrib><creatorcontrib>IVANOV V.P</creatorcontrib><creatorcontrib>NIKOL'TSEV V.A</creatorcontrib><creatorcontrib>IVANOV E.G</creatorcontrib><creatorcontrib>LAPTEV JU.P</creatorcontrib><creatorcontrib>BARANOV JU.I</creatorcontrib><creatorcontrib>KORZHAVIN G.A</creatorcontrib><creatorcontrib>PRIKHODCHENKO V.A</creatorcontrib><title>TOTALLY SEALED MICROELECTRONIC UNIT</title><description>microelectronic engineering. SUBSTANCE: totally sealed microelectronic unit used for electric circuits of radio electronic devices distinguished by functionally nonuniform composition and intricate morphology of interconnections of parts and circuit components has case divided by means of partitions into compartments, cover soldered to case over its perimeter, sealing assembly, and stuffing arrangements. Case is monolithic structure built integral with partitions; its area as viewed on top is at least 100 sq. cm. Degree of sealing with respect to helium leakage is between cm2 and 10-4 to 10-3 l Pa/s. Partitions have bulges that function as stops for additional case-to-cover fixation by compound-sealed screws. Cover underside depressions made at cover-to-partitions mating points accommodate contact springs. EFFECT: improved reliability at high integration of large structural levels of devices. 8 cl, 5 dwg</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2000</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFAO8Q9x9PGJVAh2dfRxdVHw9XQO8nf1cXUOCfL383RWCPXzDOFhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfFBoUaGpqYmZkbOhsZEKAEAL1wipQ</recordid><startdate>20000827</startdate><enddate>20000827</enddate><creator>BALANDIN V.S</creator><creator>ZHIGUNOV O.D</creator><creator>IVANOV V.P</creator><creator>NIKOL'TSEV V.A</creator><creator>IVANOV E.G</creator><creator>LAPTEV JU.P</creator><creator>BARANOV JU.I</creator><creator>KORZHAVIN G.A</creator><creator>PRIKHODCHENKO V.A</creator><scope>EVB</scope></search><sort><creationdate>20000827</creationdate><title>TOTALLY SEALED MICROELECTRONIC UNIT</title><author>BALANDIN V.S ; ZHIGUNOV O.D ; IVANOV V.P ; NIKOL'TSEV V.A ; IVANOV E.G ; LAPTEV JU.P ; BARANOV JU.I ; KORZHAVIN G.A ; PRIKHODCHENKO V.A</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_RU2155462C13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2000</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>BALANDIN V.S</creatorcontrib><creatorcontrib>ZHIGUNOV O.D</creatorcontrib><creatorcontrib>IVANOV V.P</creatorcontrib><creatorcontrib>NIKOL'TSEV V.A</creatorcontrib><creatorcontrib>IVANOV E.G</creatorcontrib><creatorcontrib>LAPTEV JU.P</creatorcontrib><creatorcontrib>BARANOV JU.I</creatorcontrib><creatorcontrib>KORZHAVIN G.A</creatorcontrib><creatorcontrib>PRIKHODCHENKO V.A</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>BALANDIN V.S</au><au>ZHIGUNOV O.D</au><au>IVANOV V.P</au><au>NIKOL'TSEV V.A</au><au>IVANOV E.G</au><au>LAPTEV JU.P</au><au>BARANOV JU.I</au><au>KORZHAVIN G.A</au><au>PRIKHODCHENKO V.A</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>TOTALLY SEALED MICROELECTRONIC UNIT</title><date>2000-08-27</date><risdate>2000</risdate><abstract>microelectronic engineering. SUBSTANCE: totally sealed microelectronic unit used for electric circuits of radio electronic devices distinguished by functionally nonuniform composition and intricate morphology of interconnections of parts and circuit components has case divided by means of partitions into compartments, cover soldered to case over its perimeter, sealing assembly, and stuffing arrangements. Case is monolithic structure built integral with partitions; its area as viewed on top is at least 100 sq. cm. Degree of sealing with respect to helium leakage is between cm2 and 10-4 to 10-3 l Pa/s. Partitions have bulges that function as stops for additional case-to-cover fixation by compound-sealed screws. Cover underside depressions made at cover-to-partitions mating points accommodate contact springs. EFFECT: improved reliability at high integration of large structural levels of devices. 8 cl, 5 dwg</abstract><edition>7</edition><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_RU2155462C1
source esp@cenet
subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title TOTALLY SEALED MICROELECTRONIC UNIT
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-21T06%3A18%3A15IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=BALANDIN%20V.S&rft.date=2000-08-27&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ERU2155462C1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true