PROCESSO PARA LIGACAO DE COMPONENTES DE MONTAGEM SUPERFICIAIS A UM SUBSTRATO

There is disclosed herein a method and apparatus for connecting surface mount components to a substrate, comprising the steps of: (1) providing an electronic assembly which includes solder paste depositions atop mounting pads on a substrate and at least one electronic component having terminations a...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WILLIAM F. QUILTY, JR, EDWARD P. MCLESKEY, ANDREW Z. GLOVATSKY, MAYANK PARIKH, PETER SINKUNAS, JAY DEAVIS BAKER, MYRON LEMECHA
Format:	Patent
Sprache:	por
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!