ENCAPSULATION BY COATING WITH A MIXTURE OF LIPIDS AND HYDROPHOBIC, HIGH MELTING POINT COMPOUNDS

An encapsulated ingredient is disclosed comprising an ingredient component and a coating component. The coating component includes a lipid and one or more hydrophobic, high melting point compounds. The coating component typically has a melting point of at least about 70° C.

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: MC GOOGAN BRUCE B, JOBE PATRICK A, FRUMHOLTZ PIERRE P
Format: Patent
Sprache:eng ; pol
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:An encapsulated ingredient is disclosed comprising an ingredient component and a coating component. The coating component includes a lipid and one or more hydrophobic, high melting point compounds. The coating component typically has a melting point of at least about 70° C.