THERMOPLASTIC COMPOSITION COMPRISING A POLYAMIDE AND A POLYSILOXANE
The present invention relates to a thermoplastic composition which comprises at least one polyamide, which preferably has a melting point of less than 185°C, and at least one liquid polysiloxane compound which preferably has a viscosity of 750 to 100,000 mPas at 25°C and is OH terminated, wherein th...
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| creator | ZAFFARONI, GIORGIO LANAU, SEBASTIEN MARCHESE, LUCA MOSCARDIN, SEBASTIANO |
| description | The present invention relates to a thermoplastic composition which comprises at least one polyamide, which preferably has a melting point of less than 185°C, and at least one liquid polysiloxane compound which preferably has a viscosity of 750 to 100,000 mPas at 25°C and is OH terminated, wherein the thermoplastic composition is obtainable by a process comprising the steps:
1a) heating the at least one polyamide
to a temperature above the melting point of the at least one polyamide and preferably below 185°C;
2a) adding under stirring
the at least one liquid polysiloxane compound
to the heated compound(s) of step 1 a), wherein the temperature is kept above the melting point of the at least one polyamide and preferably below 185°C; and
3a) mixing the obtained mixture of step 2a) preferably at 80° to 180°C, more preferably 110 to 140°C. Use of this the thermoplastic composition according to the present invention in sealants, adhesives, or as rheological modifier or surface modifier. Furthermore, to a hot melt adhesive comprising the thermoplastic composition according to the present invention. And use of this hot melt in vehicle parts, constructions, windows, glazing, sanitary applications, fittings, roofing, plumbing, appliance application and bonding of panes. |
| format | Patent |
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1a) heating the at least one polyamide
to a temperature above the melting point of the at least one polyamide and preferably below 185°C;
2a) adding under stirring
the at least one liquid polysiloxane compound
to the heated compound(s) of step 1 a), wherein the temperature is kept above the melting point of the at least one polyamide and preferably below 185°C; and
3a) mixing the obtained mixture of step 2a) preferably at 80° to 180°C, more preferably 110 to 140°C. Use of this the thermoplastic composition according to the present invention in sealants, adhesives, or as rheological modifier or surface modifier. Furthermore, to a hot melt adhesive comprising the thermoplastic composition according to the present invention. And use of this hot melt in vehicle parts, constructions, windows, glazing, sanitary applications, fittings, roofing, plumbing, appliance application and bonding of panes.</description><language>eng ; pol</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; DYES ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; POLISHES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210504&DB=EPODOC&CC=PL&NR=3034557T3$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210504&DB=EPODOC&CC=PL&NR=3034557T3$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ZAFFARONI, GIORGIO</creatorcontrib><creatorcontrib>LANAU, SEBASTIEN</creatorcontrib><creatorcontrib>MARCHESE, LUCA</creatorcontrib><creatorcontrib>MOSCARDIN, SEBASTIANO</creatorcontrib><title>THERMOPLASTIC COMPOSITION COMPRISING A POLYAMIDE AND A POLYSILOXANE</title><description>The present invention relates to a thermoplastic composition which comprises at least one polyamide, which preferably has a melting point of less than 185°C, and at least one liquid polysiloxane compound which preferably has a viscosity of 750 to 100,000 mPas at 25°C and is OH terminated, wherein the thermoplastic composition is obtainable by a process comprising the steps:
1a) heating the at least one polyamide
to a temperature above the melting point of the at least one polyamide and preferably below 185°C;
2a) adding under stirring
the at least one liquid polysiloxane compound
to the heated compound(s) of step 1 a), wherein the temperature is kept above the melting point of the at least one polyamide and preferably below 185°C; and
3a) mixing the obtained mixture of step 2a) preferably at 80° to 180°C, more preferably 110 to 140°C. Use of this the thermoplastic composition according to the present invention in sealants, adhesives, or as rheological modifier or surface modifier. Furthermore, to a hot melt adhesive comprising the thermoplastic composition according to the present invention. And use of this hot melt in vehicle parts, constructions, windows, glazing, sanitary applications, fittings, roofing, plumbing, appliance application and bonding of panes.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>DYES</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHAO8XAN8vUP8HEMDvF0VnD29w3wD_YM8fT3A7ODPIM9_dwVHBUC_H0iHX09XVwVHP1coPxgTx__CEc_Vx4G1rTEnOJUXijNzaDo5hri7KGbWpAfn1pckJicmpdaEh_gY2xgbGJqah4SYmxMjBoAbVosWA</recordid><startdate>20210504</startdate><enddate>20210504</enddate><creator>ZAFFARONI, GIORGIO</creator><creator>LANAU, SEBASTIEN</creator><creator>MARCHESE, LUCA</creator><creator>MOSCARDIN, SEBASTIANO</creator><scope>EVB</scope></search><sort><creationdate>20210504</creationdate><title>THERMOPLASTIC COMPOSITION COMPRISING A POLYAMIDE AND A POLYSILOXANE</title><author>ZAFFARONI, GIORGIO ; LANAU, SEBASTIEN ; MARCHESE, LUCA ; MOSCARDIN, SEBASTIANO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_PL3034557TT33</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; pol</language><creationdate>2021</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>DYES</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>ZAFFARONI, GIORGIO</creatorcontrib><creatorcontrib>LANAU, SEBASTIEN</creatorcontrib><creatorcontrib>MARCHESE, LUCA</creatorcontrib><creatorcontrib>MOSCARDIN, SEBASTIANO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ZAFFARONI, GIORGIO</au><au>LANAU, SEBASTIEN</au><au>MARCHESE, LUCA</au><au>MOSCARDIN, SEBASTIANO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>THERMOPLASTIC COMPOSITION COMPRISING A POLYAMIDE AND A POLYSILOXANE</title><date>2021-05-04</date><risdate>2021</risdate><abstract>The present invention relates to a thermoplastic composition which comprises at least one polyamide, which preferably has a melting point of less than 185°C, and at least one liquid polysiloxane compound which preferably has a viscosity of 750 to 100,000 mPas at 25°C and is OH terminated, wherein the thermoplastic composition is obtainable by a process comprising the steps:
1a) heating the at least one polyamide
to a temperature above the melting point of the at least one polyamide and preferably below 185°C;
2a) adding under stirring
the at least one liquid polysiloxane compound
to the heated compound(s) of step 1 a), wherein the temperature is kept above the melting point of the at least one polyamide and preferably below 185°C; and
3a) mixing the obtained mixture of step 2a) preferably at 80° to 180°C, more preferably 110 to 140°C. Use of this the thermoplastic composition according to the present invention in sealants, adhesives, or as rheological modifier or surface modifier. Furthermore, to a hot melt adhesive comprising the thermoplastic composition according to the present invention. And use of this hot melt in vehicle parts, constructions, windows, glazing, sanitary applications, fittings, roofing, plumbing, appliance application and bonding of panes.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; pol |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES |
| title | THERMOPLASTIC COMPOSITION COMPRISING A POLYAMIDE AND A POLYSILOXANE |
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