ELECTRONICS ENCLOSURES WITH HIGH THERMAL PERFORMANCE AND RELATED METHOD

Various apparatuses, methods, and systems are provided for cooling electronic components. For example, an apparatus includes an electronics enclosure having multiple ribs configured to separate electronic components. The apparatus also includes at least one fluid transport structure encased within t...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	FITZ-PATRICK, BRUCE C, CLAYTON, GARY A, SHORT, JR. BYRON E
Format:	Patent
Sprache:	eng ; pol
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CASTING CASTING OF METALS CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS POWDER METALLURGY PRINTED CIRCUITS TRANSPORTING
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