METHOD FOR COATING A SUBSTRATE WITH A POLYMER LAYER

A plasma chamber (11′) for coating a substrate with a polymer layer, the plasma chamber includes a first electrode set (14′) and a second electrode set (14′), the first and second electrode sets are arranged either side of a sample chamber for receiving a substrate, wherein the first and second elec...

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Bibliographische Detailangaben
Hauptverfasser:	LEGEIN, FILIP, FERDINANDI, FRANK
Format:	Patent
Sprache:	eng ; pol
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL SEPARATION SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING
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Beschreibung
Zusammenfassung:	A plasma chamber (11′) for coating a substrate with a polymer layer, the plasma chamber includes a first electrode set (14′) and a second electrode set (14′), the first and second electrode sets are arranged either side of a sample chamber for receiving a substrate, wherein the first and second electrode sets include plural electrode layers (141′, 142′) and wherein each electrode set includes plural radiofrequency electrode layers or plural ground electrode layers for coating polymer to each surface of a substrate.